Camera Module Bracket Step Mounting Reduces Light Leakage

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Solution Overview

Problem

Current camera modules face issues with light leakage due to the limitations of optical adhesives in terms of strength and opacity, which are compromised by miniaturization requirements, leading to suboptimal mounting of components.

Innovation Solution

The use of a reinforced adhesive layer and a mounting bracket with a flange and step configuration on the printed circuit board enhances mechanical strength and reduces light leakage, allowing for a broader range of adhesive materials and potentially lower costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If optical adhesives are used to mount the base to the circuit board, then the camera module can be miniaturized, but the mechanical strength and opacity requirements are not met, causing light leakage

Engineering Contradiction:
Improvecamera module sizeVSAvoidlight leakage prevention
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The mounting structure is segmented into multiple components: a mounting bracket with flange that interfaces with a step on the circuit board, and optical adhesives that fill the gap between them. This segmentation allows the mechanical strength requirement to be met by the bracket-step structure while the adhesives provide optical sealing to prevent light leakage, resolving the contradiction between miniaturization and reliability.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If optical adhesives are used to mount the base to the circuit board, then the camera module can be assembled, but the adhesive strength is insufficient due to miniaturization requirements

Engineering Contradiction:
Improveassembly capabilityVSAvoidadhesive bond strength
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The mounting function is divided between the mechanical bracket-step interface (providing structural strength) and the optical adhesives (providing bonding and sealing). This segmentation allows use of weaker adhesives that are easier to apply while the overall assembly strength is provided by the bracket and step structure, resolving the contradiction between ease of manufacture and bond strength.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mounting bracket with flange acts as an intermediary between the base and the circuit board step. It distributes the mechanical load and provides a stable mounting surface, while the adhesives simply need to provide optical sealing. This intermediary structure resolves the contradiction by separating the strength-providing function from the bonding function.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS10863624B2Camera module with reduced light leakage and electronic device using same
Publication Date: 2020.12.08 TRIPLE WIN TECH (SHENZHEN) CO LTD
  • US10863624B2 patent drawing
  • US10863624B2 patent drawing
  • US10863624B2 patent drawing

AI summary

A camera module with reduced light leakage includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. A step is defined at the printed circuit board. The step passes through the first surface and at least one side surface. A flange is defined on the mounting bracket. The flange is received and fixed in the step and this structure places less reliance on the strength and opacity of the particular adhesive used.