Camera BTB Connector Assembly for Mobile Terminal Miniaturization
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Solution Overview
Problem
The arrangement of devices in mobile terminals occupies a large footprint on the main circuit board, leading to wasted space resources and limited spatial utilization.
Innovation Solution
The infrared photosensitive assembly is integrated with the camera Board-to-Board connector assembly, allowing for electrical connection with the main circuit board, thereby reducing the footprint of internal devices and facilitating miniaturization by stacking these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the camera and infrared photosensitive device are separately connected to the main circuit board, then each device can be independently installed and maintained, but the footprint on the main circuit board becomes large and space resources are wasted
Solution Approach 1:
The patent combines the infrared photosensitive device with the camera module by mounting the infrared device on the camera's circuit board (camera BTB connector assembly). This merging allows both devices to share the same physical space and electrical connection interface, significantly reducing the total footprint on the main circuit board while maintaining independent functionality of each device
Solution Approach 2:
The camera module's circuit board serves multiple functions: it provides electrical connections for the camera, supports the infrared photosensitive device, and acts as an intermediate connection board (BTB connector assembly) for interfacing with the main circuit board. This multi-functionality eliminates the need for separate dedicated circuit board areas for each device
2Adaptability or versatility
If more devices are arranged on the main circuit board, then functional requirements are satisfied, but the limited space resource is insufficient and spatial utilization rate decreases
Solution Approach 1:
The infrared photosensitive device is nested on top of the camera module's circuit board, creating a layered arrangement. The camera BTB connector assembly serves as the base layer, with the infrared device mounted on it, forming a compact nested structure that maximizes space utilization without increasing the overall footprint
3Area of stationary object
If devices are stacked vertically, then spatial utilization rate improves and miniaturization is facilitated, but the arrangement complexity and connection complexity increase
Solution Approach 1:
The camera BTB connector assembly serves as an intermediary component between the main circuit board and the infrared photosensitive device. This intermediate layer simplifies the vertical stacking arrangement by providing a standardized mounting platform and electrical interface, reducing the overall connection complexity despite the three-dimensional arrangement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a compact arrangement of internal devices, enhances spatial utilization of the main circuit board, and enables the miniaturization of the mobile terminal.
Implementation Method 1
an infrared photosensitive device for identifying a distance between a human face and a screen... The infrared photosensitive device may also sense a light intensity of environment
Data Source
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AI summary
A mobile terminal and a manufacturing method thereof are provided. The method includes setting an infrared photosensitive assembly on a camera Board-to-Board connector assembly; and connecting a main circuit board of the mobile terminal with the camera Board-to-Board connector assembly set with the infrared photosensitive assembly, so that the infrared photosensitive assembly is electrically connected with the main circuit board through the camera Board-to-Board connector assembly.