Digital Camera Circuit Board Stack Design

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Solution Overview

Problem

Existing digital camera designs face challenges in optimizing space usage, accommodating different image sensors, ensuring correct orientation of electrical and mechanical connecting devices, and providing a cost-effective and reliable connection method for components within a limited camera housing.

Innovation Solution

The digital camera employs a multi-part circuit board stack with depth-milled depressions and outline milling to adjust the image sensor's position, integrates connecting devices on a single circuit board, and uses a clamp with pre-stressing arrangement for secure housing part connection, allowing for flexible component arrangement and reduced production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If separate circuit boards are used for sensor and connecting devices with different orientations, then correct orientation of electrical and mechanical connecting devices is ensured, but device complexity increases and production costs rise

Engineering Contradiction:

Improveorientation correctnessVSAvoidcircuit board arrangement

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines the electrical connecting device and mechanical connecting device onto a single circuit board, eliminating the need for separate circuit boards with different orientations. This merging reduces device complexity while maintaining correct orientation through integrated design and positioning structures.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces positioning structures such as recesses, protrusions, and alignment features as intermediaries to ensure correct orientation of the connecting devices on the circuit board. These intermediary elements mediate between the circuit board and housing to maintain precise spatial relationships without requiring separate oriented boards.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If flexible connection between individual circuit boards is used, then adaptability to different image sensors is achieved, but signal integrity problems and production costs increase

Engineering Contradiction:

Improvesensor compatibilityVSAvoidsignal integrity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

By merging all connecting devices onto a single rigid circuit board, the patent eliminates flexible connections between multiple circuit boards. This improves signal integrity by removing potential sources of interference and connection failures, while adaptability is maintained through the integrated design that can accommodate different sensor configurations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The single circuit board is designed with universal functionality to support both electrical and mechanical connecting devices, as well as accommodate different image sensor types. This multi-functional design eliminates the need for flexible connections while maintaining adaptability across different sensor configurations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Volume of moving object

If depth-milled depressions are used to receive components on another circuit board, then space requirement is optimized, but manufacturing complexity increases

Engineering Contradiction:

Improvecamera housing spaceVSAvoidcircuit board fabrication

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent utilizes the depth dimension by milling depressions into the circuit board to receive components from another circuit board. This three-dimensional arrangement optimizes space usage within the camera housing by stacking components vertically, while the milling process is a standard manufacturing technique that balances complexity with space efficiency.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Manufacturing precision

If outline milling is used to reduce circuit board thickness, then image sensor spacing adjustment is achieved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvesensor spacingVSAvoidcircuit board fabrication

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent changes the thickness parameter of the circuit board through outline milling to achieve precise spacing adjustment of the image sensor. By controlling the milling depth and positioning, the design achieves the required sensor spacing while using a standard milling process that balances manufacturing precision with ease of fabrication.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11838613B2Method for capturing data

Publication Date: 2023.12.05 ALLIED VISION TECH GMBH

AI summary

A device for capturing data in the region of a digital camera. Within a camera housing, electronic components are arranged on at least two printed circuit boards. The circuit boards are joined to form a stack. At least one recess is formed in the region of at least one circuit board on the side associated with another circuit board, to receive components arranged on another circuit board. The digital camera optionally has at least one contour milling in the region of a circuit board for height compensation relative to the image sensor in the digital camera. The mechanical securing mechanism of a connection device of an interface into a fastening element connected to the circuit board stack is integrated with the connecting of the housing parts by a preloaded clip. A method for electrical contacting, by which essential parts of the device for capturing data can be produced.