Camera Module Connector Cavity for EMI Shielding
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Solution Overview
Problem
Existing voice coil motor (VCM) technology is difficult to apply to subminiature, low-power camera modules, and there is a need for improved EMI noise blocking and reduced electrical resistance between the reinforcing member and the ground of the board in miniaturized camera modules for devices like smartphones.
Innovation Solution
A camera module design featuring a lens moving unit with a noise-blocking unit and reinforcing member, where the noise-blocking unit is partially disposed in a cavity of the board and partially on its surface, connected via an adhesive, to reduce EMI noise and electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the camera module is miniaturized to reduce size, then the device dimensions are reduced, but the EMI noise blocking performance deteriorates and electrical resistance increases
Solution Approach 1:
The noise-blocking unit is divided into multiple segments: a first portion disposed in the cavity and a second portion disposed on the connecting board. This segmentation allows the noise-blocking function to be distributed across different spatial zones, maintaining effective EMI shielding even in the miniaturized structure where a single large blocking element would be impossible to accommodate.
Solution Approach 2:
The noise-blocking unit extends in multiple dimensions by having portions at different vertical levels (in the cavity and on the surface) and horizontal positions. This multi-dimensional arrangement creates comprehensive EMI blocking coverage without increasing the overall footprint of the camera module, effectively using vertical and diagonal spatial dimensions to compensate for reduced horizontal space.
2Volume of moving object
If the camera module is miniaturized to reduce size, then the device dimensions are reduced, but the electrical resistance between the reinforcing member and the ground increases
Solution Approach 1:
The electrical connection path is segmented into multiple conductive elements distributed across the structure. Rather than relying on a single long trace, the ground connection is established through multiple points including the noise-blocking unit portions and the reinforcing member, creating parallel conduction paths that reduce overall electrical resistance despite the compact size.
Solution Approach 2:
The noise-blocking unit and the ground connection function are merged into a single integrated structure. The same conductive elements that provide EMI shielding also serve as ground connections, eliminating the need for separate ground traces and reducing electrical resistance by combining multiple functions into unified conductive pathways.
3Reliability
If VCM technology is applied to achieve autofocus function, then the camera performance is improved, but the device complexity and power consumption increase
Solution Approach 1:
The noise-blocking unit serves multiple functions simultaneously: it provides EMI shielding, establishes ground connections, and reinforces the structural integrity of the miniaturized camera module. This multi-functionality reduces the need for additional separate components that would increase complexity, allowing the camera to achieve autofocus capability without proportionally increasing device complexity.
Data Source
AI summary
An embodiment comprises a lens driving part including a lens, a connection substrate connected to the lens driving part, and a connector part connected to the connection substrate. The connector part comprises a substrate including, on the upper surface thereof, a cavity and a ground layer, a noise shield part located within the cavity of the substrate and contacting the ground layer, and a reinforcement member located on the noise shield part. The reinforcement member is located in the cavity of the substrate and on the upper surface of the substrate. In a top view, the length of one side of the noise shield part is less than the length of one side of the cavity of the substrate.