Camera Cooling Structure With Integrated Fins For Heat Dissipation
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Solution Overview
Problem
Smart devices in smart home environments face inefficiencies in heat dissipation due to compact form factors, leading to performance compromise and potential failure, as existing cooling systems are often noisy, less efficient, and more expensive.
Innovation Solution
Integration of a thermally conductive cooling structure that encloses electrical components, featuring a base form and surface features such as fins configured to enhance thermal radiation and airflow, reducing pressure drop and improving heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks and fans are used to dissipate heat from tightly packed smart devices, then heat dissipation capability is improved, but device noise increases and system efficiency decreases
Solution Approach 1:
The patent merges the housing structure with the heat dissipation function by integrating fins directly into the housing walls. This combines the protective enclosure function with the thermal management function, eliminating the need for separate large heat sinks and reducing overall system complexity while maintaining effective heat dissipation.
Solution Approach 2:
The housing structure serves multiple functions simultaneously: it provides mechanical protection for internal components, acts as a heat sink through integrated fins, and facilitates airflow for cooling. This multi-functionality reduces the need for additional dedicated cooling components that would increase noise and complexity.
2Temperature
If large heat sinks are used to improve heat dissipation, then heat dissipation efficiency is improved, but device volume and complexity increase
Solution Approach 1:
The housing structure is merged with the heat dissipation function by integrating fins directly into the housing walls. This eliminates the need for separate large heat sink components, reducing overall device volume while maintaining effective heat dissipation capability.
Solution Approach 2:
The housing serves dual purposes as both protective enclosure and heat dissipation structure. By making the housing itself thermally functional through integrated fins, the patent eliminates redundant components and reduces the volume required for thermal management.
3Temperature
If fans operate at high speeds to enhance cooling, then heat dissipation rate is improved, but energy consumption increases and noise increases
Solution Approach 1:
The housing structure is merged with passive heat dissipation features (fins) that work in conjunction with natural or low-speed forced convection. This reduces reliance on high-speed fans, thereby lowering energy consumption while maintaining effective heat dissipation through the integrated thermal management design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling structure effectively carries away heat generated by electrical components, enhancing the performance and reliability of smart devices while reducing noise and operational costs.
Implementation Method 1
The cooling structure is made from a thermally conductive material and has an exterior surface, an interior surface and a hollow portion defined by the interior surface. The exterior surface is configured to radiate away from the cooling structure heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface.
Implementation Method 2
The exterior surface is configured to radiate away from the cooling structure heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface.
Implementation Method 3
the exterior surface includes a base form and a plurality of surface features attached to the base form, and the plurality of surface features project away from the base form and are physically configured to increase rate of thermal radiation from the exterior surface
Implementation Method 4
the fins are physically configured such that the plurality of fins form a helical structure that wraps around the cooling structure, resulting curved surfaces of the fins producing substantially constant acceleration and reducing pressure drop of the airflow moving across the fins
Data Source
AI summary
The various implementations described herein include systems and devices that comprise a cooling structure. In one aspect, a camera system comprises a cooling structure made from a thermally conductive material. The cooling structure has an exterior surface, an interior surface, a hollow portion, and a sidewall. The sidewall includes a through hole that penetrates the sidewall. The exterior surface includes surface features and is configured to radiate away from the cooling structure heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The camera system further comprises a camera contained within the hollow portion of the cooling structure, a first electrical component that is embedded in the through hole, electrical components contained within the hollow portion, and an external housing that at least partially encloses the cooling structure.