Camera Module Cover Concave Solder Grounding
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Solution Overview
Problem
Existing camera module grounding methods using conductive tape or soldering are prone to failures due to thermal expansion differences, leading to potential electromagnetic interference and damage from external electric currents.
Innovation Solution
A camera module design featuring a cover with a connection portion having a concave shape that is entirely covered by solder, providing a secure ground connection to the circuit board while dispersing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If soldering method is used to ground the camera module, then the thickness of the conductive tape does not affect the camera module thickness, but cracks may occur due to difference in thermal expansion rate
Solution Approach 1:
The connection portion is designed with a concave shape that changes the geometric parameters of the solder joint. This concave configuration allows the solder to fill the cavity and create a larger bonding area, which compensates for thermal expansion differences between materials and prevents crack formation while maintaining thin profile.
Solution Approach 2:
The concave shape introduces curvature to the otherwise flat connection surface. This curved geometry provides stress distribution during thermal cycling, preventing concentration of thermal stresses that would lead to cracking, while the solder fills the concave region to create a robust joint.
2Object-affected harmful factors
If conductive tape is used to ground the camera module, then electromagnetic waves are blocked, but the thickness of the conductive tape affects the camera module thickness
Solution Approach 1:
The grounding and electromagnetic shielding function is extracted from a separate conductive tape layer and integrated directly into the cover structure itself. The cover's connection portion with concave shape provides both mechanical support and electrical grounding, eliminating the need for additional thickness from separate shielding materials.
Solution Approach 2:
The cover is designed to serve multiple functions: it provides structural protection, electromagnetic shielding, and electrical grounding all in one component. The concave connection portion enables the cover to act as both a mechanical enclosure and an electrical ground path, consolidating multiple functions into a single element.
3Object-affected harmful factors
If the cover and circuit board are grounded to prevent electromagnetic waves and external electric current, then electronic components are protected, but soldering may cause cracks due to thermal expansion difference
Solution Approach 1:
The concave shape is designed beforehand to accommodate and cushion the thermal expansion stresses that occur during soldering and subsequent thermal cycling. This pre-designed geometric feature acts as a stress-absorbing element that prevents crack formation in the solder joint while maintaining the protective grounding function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the likelihood of solder cracks and ground failures, maintaining electromagnetic shielding and protecting electronic components from external noise.
Implementation Method 1
The first concave portion of the connection portion may be entirely covered by the first solder
Data Source
AI summary
A camera module includes a housing that accommodates a lens barrel, and a cover that covers the housing. The cover includes a connection portion connected to a first circuit board by a first solder to provide a ground to the first circuit board. The connection portion has a first concave portion having a concave shape in a first direction from the first circuit board toward the housing.