Camera-Based Die Location Correction for Digital Lithography
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Solution Overview
Problem
Conventional digital lithography systems face challenges in accurately aligning dies on substrates due to misplacement during the manufacturing process, leading to inefficiencies and reduced yield in semiconductor production.
Innovation Solution
A camera-based system is employed to capture images of alignment features on substrates, determining actual die locations by comparing them to expected positions from design files, and adjusting digital lithography instructions to compensate for misalignments, thereby optimizing die placement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional digital lithography systems are used without die location correction, then the manufacturing process is simpler and faster, but the manufacturing precision and alignment accuracy of dies deteriorate
Solution Approach 1:
The system performs preliminary capture of die location images before the digital lithography process. By determining actual die locations in advance and calculating correction values beforehand, the system prepares compensation data that is then applied during lithography, ensuring precise alignment without adding complexity to the core lithography process
Solution Approach 2:
The system introduces an intermediary correction layer between the die placement and lithography processes. A correction file is generated that acts as a mediator, translating actual die positions into adjusted lithography instructions. This intermediary layer enables precision alignment while keeping the lithography system itself unchanged
2Productivity
If conventional digital lithography systems are used without die location correction, then the processing time is shorter, but the productivity and yield are reduced due to misalignment
Solution Approach 1:
The system performs preliminary capture of die location images before the digital lithography process. By determining actual die locations in advance and calculating correction values beforehand, the system prepares compensation data that is then applied during lithography, ensuring precise alignment without adding complexity to the core lithography process
Solution Approach 2:
The system replaces physical re-measurement and manual correction processes with an automated optical measurement and computational correction system. Cameras capture die positions, software calculates corrections, and the system automatically adjusts lithography instructions, eliminating time-consuming manual intervention while maintaining high precision
Data Source
AI summary
Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignment features based on their expected positioning in the design file for the packages are substrate. The cameras may then be moved to locations where alignment features should be, and images may be captured to determine the actual location of the alignment feature. These actual locations of the alignment features may then be used to identify coordinates for the dies, as well as rotations and/or varying heights of the dies on the packages. A difference between the expected location from the design file and the actual physical location may be used to adjust instructions for the digital lithography system to compensate for the misalignment of the dies.