Grounded Camera Enclosure for IP67 Board-Stack Integration
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Solution Overview
Problem
Camera manufacturers lack expertise in fabricating enclosures, leading to challenges in creating IP-rated camera products, as they often require different skill-sets from board-stack expertise.
Innovation Solution
Enclosure systems designed for board stacks that allow interchangeable lens covers and bezels, integrated connectors, and improved heat transfer, enabling IP67 compliance without the need for secondary enclosures, facilitating assembly and grounding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If camera manufacturers build complete finished products (lens, board-stack, and enclosure) themselves, then they can ensure product quality and integration, but they face hardship due to lacking expertise in fabricating enclosures which requires substantially different skill-sets from board-stack expertise
Solution Approach 1:
The patent divides the camera system into separate functional modules: board-stack assembly and enclosure assembly. The enclosure is designed as a standalone component with standardized interfaces (C-mount for lenses, back bezel for connectors) that can be manufactured by different specialists and then assembled together, allowing each manufacturer to focus on their core competency.
Solution Approach 2:
The enclosure is designed with universal interfaces and standardized mounting mechanisms that can accommodate various board-stack configurations and lens types. The C-mount interface and back bezel connector design allow the same enclosure to work with multiple different board-stack designs from different manufacturers.
2Reliability
If manufacturers use traditional integrated camera designs, then they can maintain control over the complete product, but they cannot easily achieve IP67 compliance without secondary enclosures which adds complexity
Solution Approach 1:
The patent integrates IP67 sealing features directly into the primary enclosure structure through O-ring seals at the lens interface and back bezel connections, eliminating the need for separate secondary enclosures. The enclosure itself becomes the protective housing that achieves IP compliance.
Solution Approach 2:
The enclosure implements IP67 sealing at specific critical interfaces (lens C-mount interface, back bezel connector areas) using localized O-ring seals and gasketing, rather than requiring the entire enclosure structure to be overly complex. Sealing is applied where needed to achieve compliance.
3Ease of manufacture
If manufacturers design enclosures from scratch for each board-stack configuration, then they can ensure perfect fit, but this increases manufacturing complexity and reduces interchangeability of components like lens covers and bezels
Solution Approach 1:
The enclosure employs standardized C-mount interfaces and universal back bezel connector positions that allow the same enclosure to accommodate multiple different board-stack configurations and lens types, enabling component interchangeability while maintaining proper fit and alignment.
Solution Approach 2:
The enclosure is designed with pre-configured mounting features, pre-positioned O-ring seals, and pre-aligned interface elements that ensure proper fit and sealing before final assembly. The standardized interfaces are pre-engineered to work with multiple board-stack variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables camera manufacturers to produce IP67-compliant cameras efficiently by outsourcing enclosure manufacturing, reducing complexity and ensuring compatibility with various board stacks and lenses, while maintaining IP compliance.
Implementation Method 1
improved heat transfer
Data Source
AI summary
A compact and electrically grounded enclosure facilitates locating a board stack assembly camera inside and can be rated IP67 or higher. The enclosure has connectors integrated ended in the back bezel of the enclosure and a front lens mount that allows for the direct assembly of interchangeable lens covers. The purpose of the enclosure is to take an existing board stack and locate it within the enclosure thereby forming a camera assembly. The enclosure and its packaging have improved interchangeability of the lens covers and back pieces, as well as heat transfer. Methods for assembling and mounting the board stack within the enclosure and securing the enclosure are also disclosed.