Thermally Conductive Camera Enclosure Heat Dissipation
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Solution Overview
Problem
Portable consumer electronics face thermal management challenges due to heat generated by camera modules, particularly in micro camera modules where heat from image sensors and motor drivers can cause components to exceed safe temperature limits, leading to damage or discomfort.
Innovation Solution
A camera module with a highly thermally conductive enclosure, formed from materials with a minimum thermal conductivity of 200 watts per meter Kelvin, is used to transfer heat from the rear portion to the front portion, preventing the bottom from overheating and distributing thermal energy more evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If heat generating components (image sensor, motor drivers) are mounted on or close to the rear portion of the camera module, then the camera module can provide adequate imaging capabilities in a compact form, but the rear portion surface temperature exceeds safe temperature limits leading to component damage or user discomfort
Solution Approach 1:
The patent extracts the heat management function from the traditional passive enclosure and implements an active thermal conduction system. The enclosure is designed with thermally conductive pathways that actively transfer heat away from the rear portion where image sensors and motor drivers are mounted, preventing temperature buildup while maintaining compact imaging capabilities
Solution Approach 2:
The patent introduces the enclosure itself as a thermal intermediary component. By making the enclosure highly thermally conductive, it acts as a mediator that transfers heat from the heat-generating components to larger surface areas, thereby reducing localized temperature buildup without requiring additional active cooling components
2Ease of manufacture
If traditional materials are used for the camera enclosure, then manufacturing cost and structural design are simplified, but heat cannot be effectively transferred from the rear portion to the front portion, causing overheating
Solution Approach 1:
The patent changes the thermal conductivity parameter of the enclosure material from traditional low-conductivity materials to highly thermally conductive materials. This parameter change enables effective heat transfer from the rear portion to the front portion of the enclosure, solving the overheating problem while maintaining manufacturing feasibility with established materials like aluminum or copper alloys
3Volume of moving object
If the camera module is designed in a compact micro form factor, then device thickness is reduced, but thermal management becomes more challenging as heat has fewer pathways to dissipate
Solution Approach 1:
The patent addresses thermal management in the compact micro form factor by utilizing the enclosure's surface area as an additional thermal dimension. The thermally conductive enclosure transfers heat laterally across the enclosure structure, providing heat dissipation pathways that do not increase the camera module's volume, thereby maintaining compact size while improving thermal management reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of components overheating, maintains comfortable surface temperatures, and extends the time before high temperatures are reached, thereby preventing damage and enhancing camera performance without increasing device thickness or adding heat transfer materials.
Implementation Method 1
heat produced at the bottom of the camera is conducted forward, through the stiffener and towards the top of the can so that the bottom of the stiffener does not heat to, or takes substantially longer to heat to, a 'high' temperature
Data Source
AI summary
Embodiments of the invention include devices, systems and methods for using or manufacturing a camera enclosure or mobile device that includes a thermally conductive camera module, such as having a minimum thermal conductivity of 200 watts per meter Kelvin (W/mK), that enhances heat transfer between a stiffener and cap of the enclosure. This allows heat produced by the camera to be conducted forward, away from the bottom of the stiffener, through the stiffener, and to the top of can so that the bottom of the stiffener does not heat to a high temperature, components of the device or an outer surface of a cover of the device near the bottom of the stiffener. This substantially increases the time before or avoids having the temperature of outer surface reach a high temperature, such as one that will be uncomfortable to the user. Other embodiments are also described and claimed.