Camera Heat Dissipation Fan Duct Design
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Solution Overview
Problem
Image pickup apparatuses face challenges in heat dissipation, particularly in high-temperature environments, leading to malfunctions and degradation, with existing solutions either allowing outside dust entry or increasing the apparatus size due to fan placement.
Innovation Solution
An image pickup apparatus design featuring a duct with vents and a heat dissipation fan positioned inside, connecting between the image sensor and control circuit substrates, which minimizes size increase while effectively dissipating heat through airflow, preventing dust entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation fan is disposed at the camera bottom surface to discharge air in a gap between heat sinks, then heat dissipation performance is improved, but outside dust and foreign particles easily enter the apparatus
Solution Approach 1:
A seal member is introduced as an intermediary element between the first heat sink and the second heat sink to block the passage of dust and foreign particles while allowing heat dissipation functionality to be maintained through the sealed air gap
2Temperature
If an L-shaped heat sink and duct with fan is disposed between image sensor and main substrate, then heat dissipation is improved, but the size of the apparatus increases
Solution Approach 1:
The duct is merged with either the first heat sink or the second heat sink, integrating the air passage function into the existing heat sink structure and eliminating the need for separate duct components, thereby preventing apparatus size increase
Solution Approach 2:
The heat sink structure is designed to serve multiple functions: it acts as both a thermal management component and an air passage conduit, allowing the same structure to perform both heat dissipation and airflow guidance without requiring additional space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves satisfactory heat dissipation performance without increasing the apparatus size, reducing temperatures of critical components, and preventing dust ingress, thereby ensuring prolonged image capturing times and improved reliability.
Implementation Method 1
a heat dissipation fan disposed on a bottom surface side of the exterior member... effectively dissipating heat through airflow
Implementation Method 2
a duct, having a first vent formed in the duct, is disposed between the grip portion and the mount portion... extends from the top surface side toward a bottom surface side through an area between the image sensor substrate and the control circuit substrate
Data Source
AI summary
An image pickup apparatus, having a grip portion, an image sensor, and a mount portion receives attachment of an interchangeable lens, includes a control circuit, a display panel disposed on a rear face side of an exterior member, and a heat dissipation fan disposed on a bottom surface side of the exterior member. The image sensor, control circuit, and display panel are arranged in an optical axis direction. A duct, having a first vent, is disposed between the grip and mount portions of a front face of the exterior member, extends in the optical axis direction from a top toward a bottom surface side between substrates of the image sensor and the control circuit, and connects to a second vent formed across an optical axis. The heat dissipation fan is disposed inside the duct and is located on bottom surface sides of the image sensor and the control circuit substrates.