Camera Module FPCB Layout for Compact Optical Image Stabilization

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Solution Overview

Problem

Downsized electronic devices face challenges in implementing lens assembly driving-type optical image stabilization due to limited space and the repulsive force of flexible printed circuit boards, which require high-capacity signal lines and increased power consumption.

Innovation Solution

A camera module design with a movable image sensor on a plane perpendicular to the optical axis, connected via a flexible printed circuit board with slits and parallel conducting lines, reducing repulsive force and enabling seamless optical image stabilization without high-end driving components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If lens assembly driving-type optical image stabilization is implemented, then image stabilization quality is improved, but device size increases due to space requirements for driving components

Engineering Contradiction:
Improveimage stabilization qualityVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

Instead of moving the lens assembly to achieve optical image stabilization, the patent inverts the approach by moving the image sensor in the opposite direction. This allows the lens assembly to remain stationary while the image sensor compensates for camera shake, thereby eliminating the need for complex lens driving mechanisms and reducing device size.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent replaces the mechanical lens assembly driving system with an image sensor positioning system. By using a flexible printed circuit board to enable sensor movement rather than mechanical lens driving components, the system achieves optical image stabilization with a simpler, more compact mechanical structure.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If high-capacity signal lines are used to overcome flexible printed circuit board repulsive force, then optical image stabilization performance is improved, but power consumption increases

Engineering Contradiction:
Improveoptical image stabilization performanceVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent modifies the physical parameters of the flexible printed circuit board by introducing slits that reduce its repulsive force. This parameter change allows the image sensor to move more easily during optical image stabilization, reducing the electrical force and power consumption required to overcome the board's resistance.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If flexible printed circuit board repulsive force is overcome with high-spec driving components, then optical image stabilization is achieved, but manufacturing cost increases

Engineering Contradiction:
Improveoptical image stabilizationVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the physical parameters of the flexible printed circuit board by adding slits, which reduces its repulsive force. This modification enables the use of simpler, lower-cost driving components while still achieving effective optical image stabilization, thereby reducing manufacturing costs.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent segments the flexible printed circuit board by introducing slits that divide the continuous board into separated regions. This segmentation reduces the overall repulsive force of the board, allowing optical image stabilization to be achieved with less powerful and more cost-effective driving components.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12549840B2Camera module and electronic device including same
Publication Date: 2026.02.10 SAMSUNG ELECTRONICS CO LTD
  • US12549840B2 patent drawing
  • US12549840B2 patent drawing
  • US12549840B2 patent drawing

AI summary

According to various embodiments disclosed herein, a camera module and/or an electronic device including same comprises: a lens assembly including at least one lens aligned on an optical axis; a first circuit board that includes an image sensor disposed on the optical axis and is disposed to be movable along two intersecting directions on a plane perpendicular to the optical axis; a second circuit board in which at least one connector is disposed; and a flexible printed circuit board electrically connecting the first circuit board and the second circuit board. The flexible printed circuit board includes: a first end coupled to the first circuit board; a second end coupled to the second circuit board; a plurality of extensions extending from the first end and connected to the second end; at least one slit disposed between two adjacent extensions among the plurality of extensions; and a plurality of conducting wires arranged in the plurality of extensions, wherein two or more conducting wires selected from among the conducting wires and arranged in different extensions can be connected in parallel.