Camera Module Grounding Structure for EMI-Stable Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing miniaturized camera modules face challenges in maintaining a firm bonded state between components and are susceptible to electromagnetic interference, which affects electrical characteristics and signal quality.
Innovation Solution
A camera module design featuring a first body with a protruding ground portion and a second body with an upward projecting ground portion that contact to form a grounded structure, along with a printed circuit board, to inhibit electromagnetic interference and enhance electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground portions are added to connect first body and second body, then electrical characteristics are improved and electromagnetic interference is prevented, but device complexity increases
Solution Approach 1:
The ground portions of the first body and second body are merged into a single continuous grounding structure that spans across the bonded interface. This merging eliminates electromagnetic interference by providing a unified ground path, improving electrical characteristics without requiring separate grounding components for each body.
Solution Approach 2:
The ground portions are designed to create an equipotential surface across the bonded interface between first and second bodies. By maintaining equal potential throughout the grounding structure, electromagnetic interference is prevented and electrical characteristics are stabilized, while the design keeps the added complexity minimal through straightforward geometric implementation.
2Strength
If ground portions protrude from bodies to contact each other, then bonding firmness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The ground portions are pre-formed as integral features of the first and second bodies during the manufacturing process, rather than being added as separate components. This preliminary formation ensures proper alignment and contact between ground portions is achieved through the inherent geometry of the molded parts, reducing the need for post-assembly adjustments and maintaining manufacturing feasibility.
Solution Approach 2:
The ground portions are designed with optimized geometric parameters including protrusion height, contact surface area, and positioning relative to the bonded interface. By carefully controlling these parameters, the design achieves firm bonding while maintaining tolerance levels that are compatible with standard manufacturing capabilities, balancing strength requirements with manufacturing precision.
Data Source
AI summary
A camera module comprises: a first body including a lens; a second body coupled to the first body; and a printed circuit board arranged in the first body, wherein the first body includes a first ground portion protruding downward, and the second body includes a second ground portion protruding upward to contact the first ground portion.