Camera Module Grounding Structure for EMI Shielding and Crack Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional camera modules face issues with electromagnetic wave leakage and soldering protrusion affecting other components, especially with large 1-inch image sensors, leading to increased risk of cracks.
Innovation Solution
A camera module design featuring a shield cover with a through hole and multiple solder connections between circuit boards and the shield cover, distributing stress and minimizing solder protrusion, thereby reducing the risk of cracks and electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If soldering method is used for grounding to avoid conductive tape thickness, then the thickness of the camera module is reduced, but the soldering part protrudes to the outside of the circuit board and affects other components
Solution Approach 1:
The patent transitions from planar soldering to three-dimensional soldering by utilizing the side surface of the housing. The solder connects the circuit board to the side surface of the housing rather than remaining on the same plane, thereby reducing protrusion in the vertical direction while maintaining electrical connection.
Solution Approach 2:
The housing side surface serves as an intermediary element between the circuit board and the external environment. By routing the solder through the housing side surface, the patent creates a mediating structure that reduces the harmful protrusion effect while preserving the grounding function.
2Measurement precision
If large 1-inch image sensors are adopted to improve image quality, then the image sensor size increases, but the size and weight of the lens and actuator increase, increasing the risk of cracks in the soldering part
Solution Approach 1:
The patent segments the soldering structure by separating the solder path into distinct sections: one section connects the circuit board to the housing side surface, and another section extends from the housing side surface to the shield cover. This segmentation distributes mechanical stress across multiple solder joints rather than concentrating it at a single location, thereby reducing crack risk.
Solution Approach 2:
By routing the solder through the side surface of the housing rather than through the lens assembly, the patent changes the spatial dimension of the soldering path. This dimensional change avoids the lens assembly area where cracks are most likely to occur, thereby improving reliability.
3Object-affected harmful factors
If shield cover is added to prevent electromagnetic wave leakage, then electromagnetic interference is reduced, but the device complexity increases
Solution Approach 1:
The housing side surface serves multiple functions simultaneously: it acts as a structural support element, a routing path for the solder, and a mounting surface for the shield cover. By making the housing side surface multi-functional, the patent reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving electromagnetic shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the risk of soldering cracks and electromagnetic interference by distributing stress through multiple solder connections, maintaining component integrity and reducing thickness, while ensuring electromagnetic shielding.
Implementation Method 1
a first solder connecting the first ground pad and the second ground pad
Implementation Method 2
a second solder connecting the shield cover and the second ground pad
Implementation Method 3
The camera module mounted inside the electronic device may prevent electromagnetic waves from leaking out by grounding the cover to the circuit board
Data Source
AI summary
A camera module includes a housing configured to accommodate a lens barrel; a first circuit board, disposed below the housing, including a first ground pad; a shield cover configured to cover the housing; a second circuit board, disposed on one side surface of the housing, including a second ground pad corresponding to the first ground pad; a first solder connecting the first ground pad and the second ground pad; and a second solder connecting the shield cover and the second ground pad. The second ground pad comprises a first connection part connected to the first ground pad through the first solder and a second connection part connected to the shield cover through the second solder.