Camera Head Thermal Extraction Using Integrated PCB Layers
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Solution Overview
Problem
Existing video pipe inspection camera heads face overheating issues due to the presence of both heat-producing and heat-sensitive components in compact packages, leading to potential damage, noise in captured images, and reduced lifespan, with existing heat extraction solutions being inefficient and costly to manufacture.
Innovation Solution
A compact camera head design featuring a housing assembly with thermal extraction layers and shims that direct heat away from sensitive components, using electrically isolated thermal extraction contact areas and internally formed flat spring elements or thermal contact keying elements to efficiently transfer heat to the external environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat extraction elements are added to camera heads, then heat removal efficiency is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple functions into the PCB structure itself: the PCB serves as both the electrical circuit board and the heat extraction substrate. The thermal extraction layer is integrated directly into the PCB, eliminating the need for separate heat extraction components. This merging approach improves heat removal efficiency while avoiding the manufacturing complexity of adding discrete heat extraction elements.
Solution Approach 2:
The PCB is designed to perform multiple functions simultaneously: electrical signal transmission, structural support, and thermal management. The thermal extraction contact areas on the PCB serve both as electrical connection points and as heat transfer interfaces. This multi-functionality eliminates the need for dedicated heat extraction components, resolving the contradiction between heat removal efficiency and manufacturing complexity.
2Volume of moving object
If compact packaging is used to house both heat-producing and heat-sensitive components, then device size is reduced, but overheating risk increases
Solution Approach 1:
The patent implements local thermal management by creating specific thermal extraction contact areas on the PCB that are positioned adjacent to heat-sensitive components. The thermal extraction layer is strategically placed to conduct heat away from critical areas. This localized approach allows compact packaging while preventing overheating of sensitive components through targeted heat extraction pathways.
3Temperature
If thermal extraction contact areas are electrically isolated from electrical traces, then heat transfer efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses an insulating layer as an intermediary between the thermal extraction contact areas and the electrical traces on the PCB. This insulating layer thermally couples the contact areas to the PCB while electrically isolating them from conductive traces. The intermediary approach enables effective heat transfer while maintaining electrical isolation, avoiding the need for extremely precise manufacturing tolerances that would be required if direct contact were used.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces overheating, prolongs the camera head's lifespan, maintains image quality, and addresses manufacturing inefficiencies by providing a cost-effective and efficient heat extraction mechanism.
Implementation Method 1
The PCB(s) may have a thermal extraction layer directing thermal energy from heat producing components towards PCB thermal extraction contact areas
Implementation Method 2
a plurality of thermal extraction shims that may be positioned to wedge into the space between the PCB(s) and housing assembly to transfer heat from the PCB and heat sensitive components thereon to the housing assembly and further to the external environment
Implementation Method 3
a series of internally formed flat spring elements for thermal extraction contact with thermal extraction contact areas on one or more PCBs
Data Source
AI summary
Compact camera heads as used in inspection systems having improved thermal extraction architectures are disclosed. Methods for assembling a camera head and associated components having improved thermal extraction architectures are also disclosed.