Modular Camera Head Enclosure with Personality Plate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Custom camera head enclosures are prohibitively expensive due to the need for redesign and reconfiguration when switching between different applications, as CCD arrays vary in size, sensitivity, and functionality, requiring separate enclosures for each intended use.
Innovation Solution
A modular camera head enclosure system with a personality plate that accommodates different CCD arrays and an adjustable aperture assembly, allowing for easy replacement and alignment of CCD arrays and circuit boards, enabling the use of various CCD arrays with minimal redesign, and a heat management system using fins for thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If custom camera head enclosures are designed for each specific CCD array and application, then the imaging performance and functionality are optimized for that specific use, but the cost and complexity increase significantly due to redesign requirements when switching applications
Solution Approach 1:
The camera head enclosure is designed with a universal mounting structure that can accommodate multiple different CCD arrays and circuit boards through standardized carrier interfaces. The carrier system with alignment features and standardized mounting holes allows the same enclosure to serve multiple applications without redesign, while still maintaining optimized imaging performance for each specific configuration.
2Adaptability or versatility
If custom camera head enclosures are designed for each specific CCD array and application, then the imaging performance and functionality are optimized for that specific use, but the manufacturing cost increases prohibitively
Solution Approach 1:
The enclosure design incorporates universal carriers and standardized mounting mechanisms that allow a single enclosure to be manufactured once and then configured for multiple different applications by simply changing the CCD array and circuit board components, rather than manufacturing multiple custom enclosures. This dramatically reduces per-unit manufacturing costs while maintaining application-specific optimization capabilities.
Solution Approach 2:
The camera head enclosure is segmented into modular components including the main enclosure body, removable carriers, and interchangeable CCD arrays. This segmentation allows the expensive enclosure structure to be manufactured once and reused, while only the less expensive carrier and component assemblies need to be changed for different applications, reducing overall manufacturing costs.
3Adaptability or versatility
If CCD arrays are frequently replaced for different applications, then versatility is improved, but the time and effort required for redesign and reconfiguration increases
Solution Approach 1:
The carriers are pre-configured with alignment features, mounting holes, and connection interfaces that are ready before the CCD array needs to be installed. The standardized carrier design with pre-positioned mounting features allows CCD arrays to be quickly installed without requiring any redesign or complex reconfiguration steps, significantly reducing reconfiguration time while maintaining versatility.
Solution Approach 2:
The mounting system incorporates dynamic, removable carriers that can be quickly installed and removed without permanent attachment. The carriers use reversible connection mechanisms that allow rapid exchange of CCD arrays and circuit boards, enabling frequent replacement for different applications without time-consuming reconfiguration processes.
4Ease of operation
If standardized carriers with alignment features are used, then ease of assembly is improved, but the precision of CCD array positioning may be compromised
Solution Approach 1:
The carriers incorporate pre-manufactured alignment features such as precision-machined mounting holes, registration pins, and mechanical stops that are built into the carrier structure during manufacturing. These preliminary alignment features ensure that when CCD arrays are assembled onto the carriers, they achieve precise positioning automatically without requiring complex adjustment procedures during assembly, thus maintaining both ease of assembly and positioning precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective and efficient interchangeability of CCD arrays and circuit boards across different applications without the need for extensive redesign, facilitating versatile use while maintaining effective heat management and optical alignment.
Implementation Method 1
The front and rear plates have heat fins thereon to sink heat generated by the circuit boards to ambient air
Data Source
AI summary
This invention relates to a camera head enclosure apparatus configured to allow the interchangeability of photo-electric pixel arrays for use in various applications. A personality plate specifically configured to receive and secure a photo-electric pixel array of a particular configuration provided on a chip is disclosed. The invention allows a user to interchange photo-electric pixel arrays, and their respective personality plates, while using the same camera head enclosure, thus enabling the camera head enclosure to be adapted to an entirely different photo-electric pixel array and eliminating the need to custom make camera head enclosures for each application. One embodiment of the camera head enclosure apparatus disclosed further includes a plurality of carriers configured to hold a respective plurality of circuit boards associated with the particular photo-electric pixel array selected. In addition, in one embodiment of the disclosed invention, the camera head enclosure apparatus includes an aperture adjustment assembly which permits alignment of the camera aperture with the photo-electric pixel array to provide the capability to accommodate different types, sizes, and configurations of photo-electric pixel arrays.