Endoscopic Camera Head Size Reduction via Transverse Substrate Mounting
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Solution Overview
Problem
Existing endoscopic camera heads face challenges in size reduction due to inefficient space utilization and heat management, leading to potential temperature issues and compromised radiation efficiency.
Innovation Solution
The camera head design incorporates a flexible substrate mounted on the transverse face side of the imaging unit, utilizing space not occupied by image sensors, and separates electronic components with different heat generation rates into distinct chassis areas for efficient heat radiation using partition walls and radiation sheets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the camera head is reduced, then miniaturization is achieved, but heat radiation efficiency deteriorates due to insufficient space for radiation structures
Solution Approach 1:
The patent utilizes the transverse face side of the imaging unit (a previously underutilized spatial dimension) to mount the flexible substrate, thereby creating dedicated heat radiation pathways without increasing the overall camera head volume. This dimensional reorganization allows heat to be conducted laterally to radiation structures positioned at the transverse face, improving thermal management in the miniaturized form factor.
Solution Approach 2:
The camera head is segmented into distinct functional zones: the imaging unit with image sensors, the flexible substrate mounted on the transverse face side for heat-conducting electronic components, and dedicated heat radiation structures. This segmentation allows independent optimization of each zone, enabling effective heat management without compromising the compact overall design.
2Volume of moving object
If space inside the camera head is not effectively utilized, then assembly is simplified, but camera head size cannot be further reduced
Solution Approach 1:
The transverse face side of the imaging unit serves multiple functions: it provides a mounting surface for the flexible substrate containing heat-sensitive electronic components, acts as a heat conduction pathway, and facilitates external heat radiation. This multi-functionality maximizes space utilization without adding structural complexity, as the same surface area serves thermal, mechanical, and spatial organization purposes simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for further size reduction of the camera head while improving radiation efficiency and managing heat distribution effectively, preventing temperature issues and enhancing image quality.
Implementation Method 1
the flexible substrate is arranged on the transverse face side of the imaging unit
Implementation Method 2
improve radiation efficiency of a small-sized camera head
Data Source
AI summary
Provided is a camera head capable of further size reduction. A camera head of a camera device is provided with an imaging unit having three image sensors, a flexible substrate connected to the three image sensors, and a chassis in which the imaging unit is accommodated and on which the flexible substrate is mounted. The three image sensors are provided on the upper face side, the rear face side, and the lower face side of the imaging unit, respectively, and the flexible substrate is arranged on the transverse face side of the imaging unit on which the image sensors are not provided in the chassis.