Miniaturized Camera Heat Dissipation via Metal Member
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Solution Overview
Problem
Miniaturization of camera devices leads to increased complexity and heat generation due to reduced space between circuit elements, making effective heat dissipation from camera modules problematic.
Innovation Solution
A heat dissipating arrangement using a metal heat dissipation member with high thermal conductivity, such as copper or aluminum, integrated into the pedestal bracket of the camera module, which is designed to efficiently discharge heat from the printed circuit board and imaging sensor chip to the exterior through an insert molding method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If camera device is miniaturized with increased number of pixels and circuit complexity, then camera features and pixel count are improved, but heat generation increases and heat dissipation becomes problematic
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional camera module structure by introducing a separate heat dissipation member with high thermal conductivity material. This member is positioned to contact the imaging sensor chip and conduct heat away from the module, effectively separating the heat generation source from the sensitive imaging components while maintaining the miniaturized form factor.
Solution Approach 2:
The patent employs composite material strategy by using heat dissipation member made of high thermal conductivity material (such as metal) combined with the existing camera module structure. This composite approach allows efficient heat transfer from the imaging sensor chip through the heat dissipation member to the external environment, resolving the thermal management issue in miniaturized devices.
2Device complexity
If space between circuit elements is reduced to increase circuit complexity, then camera features are improved, but heat generation increases
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional camera module structure by introducing a separate heat dissipation member with high thermal conductivity material. This member is positioned to contact the imaging sensor chip and conduct heat away from the module, effectively separating the heat generation source from the sensitive imaging components while maintaining the miniaturized form factor.
Solution Approach 2:
The heat dissipation member acts as an intermediary between the imaging sensor chip and the external environment. It provides a dedicated thermal conduction path that mediates the heat transfer process, allowing heat to be efficiently conducted away from the densely packed circuit elements without interfering with the electrical connections or signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat buildup within the camera module, improving cooling efficiency and preventing overheating issues in compact camera devices.
Implementation Method 1
A heat dissipating arrangement using a metal heat dissipation member with high thermal conductivity, such as copper or aluminum, integrated into the pedestal bracket of the camera module, which is designed to efficiently discharge heat from the printed circuit board and imaging sensor chip to the exterior
Data Source
AI summary
A small-scale camera device with heat-dissipating properties includes a pedestal bracket and a camera module mounted on the pedestal bracket. The pedestal bracket includes a top plate and a side plate extending perpendicularly from edges of the top plate. The side plate includes an inner side surface and an outer side surface opposite to the inner side surface. The bottom of the side plate defines a plurality of first receiving recesses, each of the first receiving recesses carries a heat dissipation member.