Image Capture Heatsink Layout for Sealed Camera Thermal Loads
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Solution Overview
Problem
The increased thermal loads in image capture devices due to advancements in technology and added components pose a challenge for effective thermal management, potentially impacting device operation and component durability.
Innovation Solution
The implementation of a heatsink with a planar surface and a sheet conductor made of a material with higher thermal conductivity than the heatsink, which is connected to the printed circuit board via a thermal interface material, providing enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If faster components and additional functionality are added to the camera, then image quality and functionality are improved, but thermal load increases
Solution Approach 1:
The patent extracts the thermal management function by introducing a dedicated heatsink structure that is integrated into the camera housing. The heatsink includes a heat spreader in direct contact with the image sensor and a heat dissipation structure with multiple fins that extend outward, effectively separating the heat generation zone (sensor) from the heat dissipation zone (fins exposed to air), thus resolving the thermal load issue while maintaining high-speed component performance
Solution Approach 2:
The heatsink structure serves multiple functions: it acts as a thermal management system for the image sensor, provides structural support within the camera housing, and may serve as a mounting surface for other components. The heat dissipation fins simultaneously increase surface area for thermal radiation and may function as structural reinforcement, demonstrating multi-functionality that addresses thermal issues without compromising image quality improvements
2Reliability
If the camera is sealed for water resistance, then durability is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The heatsink is nested within the sealed camera housing structure. The heat dissipation fins are contained within the waterproof enclosure, and the entire thermal management system is integrated into the existing housing design. This nesting approach allows effective heat dissipation through the sealed structure without compromising water resistance, as the heat travels through solid thermal paths (heat spreader to fins) that are contained within the waterproof boundary
Solution Approach 2:
The heatsink acts as an intermediary between the heat-generating image sensor and the camera housing/water environment. It provides a controlled thermal pathway that allows heat to be efficiently transferred from the sensor through the heat spreader and fins, while the sealed housing maintains water resistance. The intermediary heatsink structure enables thermal management without requiring openings in the waterproof seal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat within the image capture device, allowing for extended use and preventing component damage by efficiently dissipating thermal energy.
Implementation Method 1
The sheet conductor is made of a material that has a higher thermal conductivity than the material of the heatsink
Data Source
AI summary
A housing, a bayonet, a lens cover, an integrated sensor and lens assembly, and a heatsink. The bayonet is on an outer side of the housing. The lens cover is connected to the housing by the bayonet. The integrated sensor and lens assembly includes a mounting arm. The mounting arms are configured to receive fasteners to connect the ISLA to the bayonet. The heatsink includes a cutout and an LCD recess. The integrated sensor and lens assembly extends through the cutout. The cutout is complementary in shape to the mounting arms so that fasteners extend through the mounting arms, through the cutout, and into the bayonet. The LCD recess is located on a front side of the heatsink that is configured to receive a liquid crystal display, wherein the LCD recess is on an opposite side of the heatsink as the PCB.