Camera-Hole Display Structure with Buffer Crack Isolation
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Solution Overview
Problem
The formation of a camera hole in display devices through laser-beam irradiation can cause cracks, which extend to the display area, leading to picture quality degradation and device deterioration.
Innovation Solution
A display device design featuring a hole area surrounded by a buffer area with a damage preventing portion made of the same material as the source and drain electrodes, preventing cracks from extending to the display area by disconnecting encapsulation layers during laser cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a camera hole is formed through laser-beam irradiation to place a camera in the display device, then the camera functionality is achieved, but cracks are generated that extend to the display area causing picture quality degradation and device deterioration
Solution Approach 1:
The display device is segmented into distinct functional areas: a display area, a buffer area surrounding the hole area, and a non-display area. This segmentation isolates the damage from the camera hole formation to the buffer area, preventing crack propagation to the display area while maintaining camera functionality.
Solution Approach 2:
The buffer area acts as an intermediary zone between the hole area (where the camera is placed) and the display area. This intermediate region absorbs and contains the cracks generated during laser-beam irradiation, serving as a protective barrier that prevents damage from reaching the display area.
2Adaptability or versatility
If the camera hole is formed by removing areas through laser-beam irradiation, then the camera can be placed inside the display device, but damages such as cracks are generated during the process
Solution Approach 1:
The buffer area is designed in advance as a protective structure that will counteract the harmful effects of crack propagation. By pre-positioning this buffer zone around the hole area before laser-beam irradiation, the system is prepared to resist and contain the damages that will inevitably occur during camera hole formation.
Solution Approach 2:
The buffer area transforms the potentially harmful cracks from the laser-beam process into a contained feature within the buffer zone. Instead of allowing cracks to propagate freely and damage the display area, the buffer area captures and localizes these cracks, converting a harmful effect into a controlled, isolated phenomenon that does not affect device functionality.
3Reliability
If the buffer area is provided to surround the hole area to prevent crack extension, then display area integrity is maintained, but the device structure becomes more complex
Solution Approach 1:
The buffer area is merged with the existing display device structure, utilizing the same substrate and manufacturing processes. Rather than adding a completely separate protective layer, the buffer area is integrated into the device architecture during the same fabrication process, reducing overall structural complexity while maintaining protective functionality.
Solution Approach 2:
The buffer area serves multiple functions simultaneously: it provides mechanical support to the substrate, acts as a crack propagation barrier, and defines the boundary between the hole area and display area. This multi-functionality reduces the need for additional separate protective structures, thereby simplifying the overall device design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents cracks from spreading to the display area, maintaining picture quality and reducing manufacturing complexity and costs by integrating the damage preventing portion with existing electrode patterning processes.
Implementation Method 1
a camera hole for placing the camera in the display device has to be provided. Generally, the camera hole is obtained by a process of removing some areas from the display device through a laser-beam irradiation
Data Source
AI summary
Discussed is a display device including an organic light emitting device in a display area on a substrate, a thin film transistor connected with the organic light emitting device, a planarization layer on the thin film transistor, a protecting portion on a buffer area on the substrate, the protecting portion surrounding at least a portion of a camera area on the substrate, the buffer area disposed between the display area and the camera area, a dam structure on the buffer area, the dam structure apart from the protecting portion, an encapsulation layer including a first encapsulation layer, a second encapsulation layer on the first encapsulation layer, and a third encapsulation layer on the second encapsulation layer, and a hole in the camera area, the hole provided inside the display area. The first encapsulation layer and the third encapsulation layer are disposed on a side surface of the planarization layer.