Camera Module Housing with Embedded Conductive Traces
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Solution Overview
Problem
Conventional camera modules in consumer devices face challenges with increased thickness and tilt management due to the mounting of dies over a printed circuit board assembly (PCBA), which limits their integration in smaller devices and requires precise alignment, while also reducing the usable surface area and increasing focal length.
Innovation Solution
A camera module design featuring a housing with conductive traces embedded within, allowing for the image sensor to be mounted on a projection within the housing, electrically interconnected via stud bumps, and separated from the PCBA, enabling precise alignment and reduced thickness, while providing additional space on the PCBA for other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If dies are mounted over a printed circuit board assembly (PCBA), then electrical interconnection is achieved, but the overall thickness of the camera module increases
Solution Approach 1:
The patent merges the housing structure with the electrical interconnection function by integrating conductive traces directly into the housing. This eliminates the need for a separate PCBA, thereby reducing the overall thickness while maintaining electrical connectivity between the image sensor and other components.
Solution Approach 2:
The patent extracts the PCBA from the camera module design by directly mounting the image sensor to the housing with integrated conductive traces. This removal of the intermediate PCBA layer reduces the overall thickness and simplifies the mounting structure.
2Area of stationary object
If dies are mounted over a printed circuit board assembly (PCBA), then electrical interconnection is achieved, but the usable surface area of the PCBA is reduced
Solution Approach 1:
The patent extracts the PCBA from the design, eliminating the limitation on usable surface area. By mounting the image sensor directly to the housing with integrated conductive traces, the entire housing surface becomes available for component placement and other functions.
Solution Approach 2:
The housing serves multiple functions: it provides structural support, acts as the mounting substrate for the image sensor, and contains the conductive traces for electrical interconnection. This multi-functionality eliminates the need for a separate PCBA and maximizes the usable surface area.
3Manufacturing precision
If dies are mounted over a printed circuit board assembly (PCBA), then electrical interconnection is achieved, but precise alignment between the image sensor and lens becomes more difficult
Solution Approach 1:
The patent merges the mounting structure with the optical axis alignment by integrating the image sensor mounting directly into the housing structure that also supports the lens. This integration ensures that the image sensor is automatically aligned with the lens along the optical axis, improving manufacturing precision.
Solution Approach 2:
The patent removes the intermediate PCBA that complicates alignment. By mounting the image sensor directly to the housing with built-in alignment features, the alignment process is simplified and precision is improved.
4Length of stationary object
If dies are mounted over a printed circuit board assembly (PCBA), then electrical interconnection is achieved, but the focal length increases
Solution Approach 1:
The patent extracts the intermediate PCBA layer that increases the distance between the lens and the image sensor. By mounting the image sensor directly to the housing, the focal length is reduced, allowing for more compact camera module design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the overall thickness and tilt management issues, allows for precise alignment of the image sensor with the lens, and increases the usable surface area on the PCBA, facilitating integration into smaller devices with improved component placement.
Implementation Method 1
electrically interconnected via stud bumps
Data Source
AI summary
A camera module including a housing with embedded conductive traces that allow for an increase in usable surface area of a corresponding printed circuit board (PCB) or multi-layer substrate, a reduced overall thickness of the module, a reduction in tilt management of a lens element of the module, and a facilitation in alignment of the lens element relative to the image sensor. An image sensor is electrically interconnected to first portions of the conductive traces by way of a flip chip process, and then the housing may be mounted over the PCB so that second portions of the conductive traces interconnect with corresponding conductive pads on the PCB to electrically interconnect the image sensor die to the PCB. In one arrangement, another die may be electrically interconnected to the PCB so that as assembled, the die is disposed between the image sensor and the PCB.