Camera With Integrated Circuit Board For Panoramic Stitching

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Solution Overview

Problem

Conventional single-lens cameras have limited view angles and blind spots, making them inadequate for large-scale outdoor monitoring, such as roads, bridges, and squares, and multi-lens panoramic cameras are costly and difficult to install effectively.

Innovation Solution

A camera system comprising an integrated circuit board and multiple image sensor boards with image sensors configured for stitching and encoding, using FPGA and DSP components for seamless image processing and transmission via differential signal lines, allowing for panoramic shooting with improved installation simplicity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If multiple cameras are used to achieve panoramic monitoring, then the view angle is improved, but the equipment cost and installation complexity increase

Engineering Contradiction:
Improveview angleVSAvoidinstallation complexity
Core Design Contradiction:
Area of moving objectVSDevice complexity

Solution Approach 1:

The camera system divides the imaging function into multiple image sensors arranged in different directions, with each sensor capturing a specific field of view. The integrated circuit board processes and stitches these segmented images to form a complete panoramic view, resolving the contradiction by segmenting the imaging task rather than using a single complex camera.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple image sensors and their processing circuits are merged into a single integrated camera system with a common housing and coordinated control. This merging allows the system to achieve panoramic coverage while maintaining unified installation and operation, reducing the complexity compared to deploying multiple independent cameras.

Inventive Principle:
Principle #5Merging (Combining)

2Area of moving object

If multiple cameras are deployed for panoramic coverage, then the monitoring range is improved, but the equipment cost increases

Engineering Contradiction:
Improvemonitoring rangeVSAvoidequipment cost
Core Design Contradiction:
Area of moving objectVSQuantity of substance

Solution Approach 1:

Multiple image sensors are combined within a single camera housing with shared power supply, control circuitry, and processing unit. This merging reduces the total equipment cost compared to deploying multiple independent cameras while achieving the same panoramic monitoring range.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated circuit board performs multiple functions including image processing from multiple sensors, stitching algorithms, and output generation, making the system more cost-effective than using separate dedicated devices for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of moving object

If images from multiple cameras are stitched, then the panoramic effect is improved, but the installation precision requirement increases

Engineering Contradiction:
Improvepanoramic effectVSAvoidinstallation precision
Core Design Contradiction:
Area of moving objectVSManufacturing precision

Solution Approach 1:

The relative positions and orientations of multiple image sensors are predetermined and fixed during manufacturing with precise mechanical structures. This preliminary positioning eliminates the need for complex on-site calibration and ensures accurate image stitching without requiring high installation precision in the field.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system replaces mechanical alignment requirements with electronic image processing and software-based stitching algorithms. This substitution allows for flexible adjustment of image parameters digitally, reducing the need for precise mechanical installation while achieving excellent panoramic effects.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentEP3328052B1Camera and integrated circuit board
Publication Date: 2023.11.29 HANGZHOU HIKVISION DIGITAL TECHNOLOGY CO LTD
  • EP3328052B1 patent drawingFigure 1~2
  • EP3328052B1 patent drawingFigure 3~4
  • EP3328052B1 patent drawingFigure 5~6

AI summary

The present application discloses a camera and an integrated circuit board. The camera includes: an integrated circuit board and a plurality of image sensor boards, wherein an image sensor is mounted on each of the image sensor boards; the plurality of image sensor boards are configured for outputting acquired first image signals to the integrated circuit board; and the integrated circuit board is connected with the plurality of image sensor boards and configured for performing stitching and encoding processing on the first image signals. The present application solves the technical problem that it is difficult for camera equipment provided in the prior art to achieve panoramic shooting.