Camera Lens Driver Layout for Sensor Noise and Space Constraints
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Solution Overview
Problem
Existing camera modules face challenges in mounting large-diameter lenses without increasing size, ensuring stable power supply to position sensors, and effectively eliminating noise from sensor outputs, particularly in subminiature, low-power applications.
Innovation Solution
The design incorporates an escape groove in the cover to prevent heat loss during soldering, exposes additional terminals for evaluating AF characteristics, and strategically places capacitors in the housing to stabilize power supply and reduce noise, while maintaining a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a large-diameter lens is mounted in the camera module, then the optical performance and resolution are improved, but the size of the camera module increases
Solution Approach 1:
The patent utilizes the thickness dimension (z-axis) of the housing to accommodate the capacitor, rather than expanding the planar dimensions (x-y plane). By forming a groove in the thickness direction of the housing and placing the capacitor within this groove, the design allows for larger lens diameter and improved optical performance without increasing the overall footprint area of the camera module.
2Reliability
If a capacitor is added to stabilize power supply and reduce noise, then the reliability of position sensor operation is improved, but the device complexity and space requirements increase
Solution Approach 1:
The capacitor is integrated into the housing structure by forming a groove directly in the housing body and placing the capacitor within this groove. This merging of the capacitor with the housing structure eliminates the need for separate mounting brackets, adhesive layers, or additional fastening mechanisms, thereby reducing overall device complexity while maintaining power supply stability and noise reduction functions.
Solution Approach 2:
The capacitor is nested within a groove formed in the housing structure, allowing it to be accommodated within the existing spatial envelope of the camera module. This nesting approach enables the addition of the capacitor for improved reliability without requiring external expansion or additional structural support elements.
3Adaptability or versatility
If the housing structure is modified to accommodate additional components, then the functionality and reliability are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The groove is formed only in the specific region of the housing where the capacitor needs to be accommodated, rather than modifying the entire housing structure. This localized modification approach allows for improved adaptability and component accommodation capability while concentrating manufacturing precision requirements only to the local groove area, making the overall manufacturing process more feasible.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the mounting of large-diameter lenses without size increase, provides stable power to position sensors, reliably eliminates noise, and facilitates easier sealing and evaluation of drive characteristics.
Implementation Method 1
a first capacitor, which has a thickness greater than a thickness of the position sensor, is disposed on a first corner portion of the housing
Implementation Method 2
an escape groove is formed in the portion of the cover 1100 at which an elastic member is soldered to a circuit board in order to prevent heat loss
Data Source
Figure 1
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AI summary
One embodiment comprises: a housing; a bobbin arranged in the housing; a coil arranged in the bobbin; a first magnet arranged at a first lateral part of the housing; a second magnet arranged at a second lateral part of the housing facing the first lateral part of the housing; a circuit board arranged at a third lateral part of the housing; a location sensor which is arranged at the third lateral part of the housing and which is electrically connected with the circuit board; and a first capacitor arranged at a first corner part of the housing, which is arranged between the third lateral part of the housing and the second lateral part of the housing, and electrically connected with the circuit board.