Camera Module Lens Holder Bonding for Tilt Prevention

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Solution Overview

Problem

Conventional camera modules face issues with vertical tilting of the lens unit due to improper epoxy coating, leading to reduced adhesive strength and performance degradation from heat and gas generated during curing, which affects image resolution and causes ghost phenomena.

Innovation Solution

Bonding the lens unit to the lateral surface of a holder with two bodies, where the lens unit is fixed to the inner surface of one body and the other body is mounted on top, with exhaust grooves on the contacted surfaces to discharge heat and gas, enhancing adhesive power and preventing vertical tilting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If epoxy is coated to bond the lens unit to the PCB, then the lens unit is fixed in position, but vertical tilting occurs due to improper coating leading to reduced adhesive strength

Engineering Contradiction:
Improveadhesive strengthVSAvoidvertical tilt
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The holder is divided into two separate bodies: a first body that bonds to the lens unit and a second body that mounts to the first body. This segmentation allows the bonding surface to be separated from the mounting surface, enabling better control of adhesive coating and preventing vertical tilting while maintaining strong bonding.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The lens unit is bonded to the lateral surface of the holder rather than the top surface. This dimensional change in bonding orientation provides a larger effective bonding area and allows for more uniform epoxy distribution, eliminating vertical tilt issues while maintaining strong adhesion.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If epoxy is coated for bonding, then the lens unit is fixed, but heat and gas generated during curing reduce adhesive power and cause ghost phenomena

Engineering Contradiction:
Improveadhesive performanceVSAvoidheat and gas
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

Exhaust grooves are created to extract and vent the heat and gas generated during epoxy curing. These grooves provide escape paths for harmful byproducts, preventing them from compromising adhesive performance and causing ghost phenomena, while allowing the bonding process to proceed effectively.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The exhaust grooves convert the harmful heat and gas byproducts of curing into a beneficial venting mechanism. By providing controlled escape paths, the design transforms potential defects into a feature that actually improves bonding reliability by preventing pressure buildup and adhesive degradation.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Device complexity

If the lens unit is bonded to the PCB, then the structure is simple, but the bonded surface is narrow reducing adhesive strength

Engineering Contradiction:
ImprovestructureVSAvoidadhesive power
Core Design Contradiction:
Device complexityVSStrength

Solution Approach 1:

The bonding interface is moved from the top surface (PCB plane) to the lateral surface of the holder. This dimensional repositioning provides a significantly larger bonding area for the epoxy adhesive, dramatically increasing adhesive strength while the two-body holder structure adds minimal complexity to the overall assembly.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration prevents vertical tilting, increases adhesive strength, and reduces the occurrence of ghost phenomena and resolution degradation by allowing for better heat and gas discharge during epoxy curing.

Implementation Method 1

exhaust grooves for discharging gas and heat generated in the course of curing adhesive

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

exhaust grooves for discharging gas and heat generated in the course of curing adhesive

Methodology Applied
Scientific EffectGas discharge:

Implementation Method 3

adhesive for the light to be irradiated to the image sensor (2) through the plurality of lenses

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9041850B2Camera module for tilt balance of lens
Publication Date: 2015.05.26 LG INNOTEK CO LTD
  • US9041850B2 patent drawing
  • US9041850B2 patent drawing
  • US9041850B2 patent drawing

AI summary

The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light converged through the lenses to an electric signal; a PCB (Printed Circuit Board) mounted with the image sensor; and a holder accommodated inside the lens unit for supporting the lens unit, wherein the lens unit is bonded and fixed at an inner surface of the holder, whereby the lens unit mounted with a plurality of lenses is bonded to a lateral surface of a holder to prevent generation of vertical tilting phenomenon at the lens unit caused by a conventional improper coating of epoxy, and particularly, the coating of epoxy on the lateral surface of the holder advantageously enhances adhesive power to increase a bonded area.