Camera Module MLCC Nesting in Metal Plate for Space Saving
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Solution Overview
Problem
The presence of a separate space for mounting a multi-layer ceramic condenser (MLCC) in camera modules increases the size of the camera module and degrades space utilization.
Innovation Solution
The camera module design incorporates a multi-layer ceramic condenser (MLCC) disposed in holes formed in a metal plate under a rigid printed circuit board (RPCB), allowing the MLCC to be positioned in proximity to the image sensor without requiring a separate mounting space, thus enhancing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a separate space for mounting a MLCC is provided, then the MLCC can be mounted, but the size of the camera module increases
Solution Approach 1:
The patent merges the MLCC mounting function with the existing metal plate structure by forming holes directly in the metal plate, eliminating the need for a separate mounting space and thereby reducing the overall camera module size while maintaining manufacturing capability
Solution Approach 2:
The MLCC is nested within the holes of the metal plate structure, utilizing the existing structural space for dual purposes (structural support and component mounting), which reduces the total volume required for the camera module
2Ease of manufacture
If a separate space for mounting a MLCC is provided, then the MLCC can be mounted, but space utilization in the camera module is degraded
Solution Approach 1:
The patent combines the MLCC mounting function with the metal plate structure by integrating holes into the metal plate, eliminating wasted space and improving overall space utilization while maintaining ease of MLCC mounting
Solution Approach 2:
The metal plate is designed to serve multiple functions: providing structural support, enabling image sensor mounting, and facilitating MLCC mounting through integrated holes, thereby maximizing space utilization without compromising manufacturing ease
3Area of stationary object
If the MLCC is disposed in holes in the metal plate under the RPCB, then space utilization is enhanced, but the MLCC height must be less than the metal plate height
Solution Approach 1:
The patent applies local quality by creating specific holes in the metal plate at designated locations, allowing the MLCC to be positioned precisely where needed with controlled height, thereby enhancing space utilization while maintaining adaptability through localized structural modifications
Data Source
AI summary
A camera module according to an embodiment of the present disclosure may comprise: a rigid printed circuit board (RPCB), a metal plate coupled to the lower surface of the RPCB and having one or more holes formed therein, a multi-layer ceramic condenser (MLCC) disposed in the one or more holes in the RPCB, and an image sensor disposed on the metal plate. With reference to the lower surface of the RPCB, the MLCC may be formed to have a height less than the height of the metal plate. A camera module structure according to an embodiment of the present disclosure may comprise: a flexible printed circuit board (FPCB), an RPCB coupled to the lower surface of the FPCB and having one or more first holes formed therein, a metal plate coupled to the lower surface of the RPCB and having one or more second holes formed in areas corresponding to the first holes, respectively, an MLCC disposed in the first holes and the second holes below the FPCB, and an image sensor disposed on the metal plate. The MLCC may be disposed in at least one of spaces formed through the first holes and the second holes. According to various embodiments of the present disclosure, a different camera module structure may be utilized such that no separate space is necessary to mount a laminated ceramic capacitor, and space utilization may be improved.