Camera Module UV Curing Adhesive Groove Assembly
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Solution Overview
Problem
The manufacturing process of camera modules is time-consuming and prone to defects due to variations in coupling structures, affecting the reliability and defect rate of the final product.
Innovation Solution
A camera module design featuring a lens assembly, image sensor, lens holder, substrate with a groove for secure insertion, and a UV curing adhesive for stable attachment without heat treatment, which simplifies the assembly process and reduces defects by preventing thermal deformation and dust ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional coupling structures and methods are used to attach the lens holder to the substrate, then the assembly can be manufactured, but the manufacturing time increases and the defect rate increases due to process complexity and thermal deformation
Solution Approach 1:
The patent replaces traditional mechanical coupling structures (screws, clips, or heat-based attachment) with a chemical bonding system using UV-curing adhesive. The adhesive is applied in a groove on the substrate, and the lens holder is attached through UV light curing, eliminating complex mechanical assembly steps and thermal processes that cause deformation and defects.
Solution Approach 2:
The patent changes the curing parameter from thermal (heat-based) to photonic (UV light-based). This parameter change allows the adhesive to cure rapidly without generating heat that could deform the lens holder or substrate, thereby reducing manufacturing time and eliminating thermal deformation defects.
2Strength
If complex coupling structures are used to ensure secure attachment, then the attachment strength improves, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The patent extracts the attachment function from complex mechanical coupling structures and concentrates it into a simple groove-based adhesive bonding system. The groove structure simplifies the coupling design while the UV-curing adhesive provides sufficient attachment strength, eliminating the need for complex mechanical features.
Solution Approach 2:
The patent combines the attachment function and the structural support function into a single integrated groove structure on the substrate. The groove both positions the lens holder and provides the bonding interface for the adhesive, merging multiple functions into one simple feature that reduces overall device complexity.
3Reliability
If traditional adhesive curing methods using heat are used, then the adhesive can be cured, but thermal deformation occurs and dust may ingress during the prolonged curing process
Solution Approach 1:
The patent replaces thermal curing with UV light curing, substituting a thermal field with a photonic field. This eliminates heat generation during the curing process, preventing thermal deformation of the lens holder and substrate while also shortening the curing time to prevent dust ingress.
Solution Approach 2:
The patent utilizes the phase transition of the UV-curing adhesive from liquid to solid state through photopolymerization. This phase change occurs rapidly upon UV light exposure, providing immediate structural stability without requiring prolonged heating, thereby preventing dust contamination and thermal damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing time, lowers defect rates, and enhances product reliability by ensuring secure and dust-free assembly of components, improving image performance and overall camera module quality.
Implementation Method 1
a curing adhesive for attaching the substrate to the lens holder
Data Source
AI summary
Provided are embodiments of a camera module and a mobile terminal having the same. In embodiments, the manufacturing process may be simplified, a defect ratio may be reduced, and product reliability may be improved. The camera module can include a lens assembly, an image sensor formed below the lens assembly, a lens holder covering the image sensor and coupled to the lens assembly, a substrate having a groove corresponding to a shape of a lower surface of the lens holder to allow the lens holder to be inserted and fixed in the groove, and a curing adhesive for attaching the substrate to the lens holder. In an embodiment, the curing adhesive can be an ultra-violet curing adhesive.


