Mobile Phone Camera Module Adhesive Lens Fixation
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Solution Overview
Problem
Particles generated during the focusing assembly of mobile phone cameras with fixed focal length drop directly on the chip's surface, affecting image quality due to the threaded focusing mechanism.
Innovation Solution
A mobile phone camera module design featuring a bracket assembly with an accommodation cavity, a flexible circuit board, a chip, a lens assembly, and a connecting portion, where the connecting portion is an adhesive layer made of AA glue, ensuring the lens and bracket assemblies are fixed without a threaded structure, preventing particles from falling on the chip and enhancing stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a threaded focusing mechanism is used to enable focusing assembly, then the camera can perform focusing function, but particles are generated and drop on the chip surface affecting image quality
Solution Approach 1:
The patent removes the threaded focusing mechanism entirely from the camera module. The lens assembly is fixed to the bracket assembly using adhesive without any threading, which eliminates the source of particle generation while maintaining the focusing capability through alternative means
Solution Approach 2:
The patent replaces the mechanical threaded focusing system with a non-threaded adhesive bonding system. This substitution eliminates the mechanical threads that generate particles during assembly, thereby preventing particle contamination on the chip surface
2Strength
If a threaded focusing mechanism is used for assembly, then the lens and bracket can be connected, but the assembly process generates particles that affect image quality
Solution Approach 1:
The patent replaces the mechanical threaded connection system with a chemical adhesive bonding system. The adhesive provides sufficient connection strength between the lens assembly and bracket assembly without generating particles during the bonding process
Solution Approach 2:
The patent changes the connection method from mechanical (threaded) to chemical (adhesive bonding). This parameter change in the connection mechanism eliminates particle generation while maintaining or improving the connection strength between components
3Device complexity
If the camera module uses traditional threaded focusing assembly, then the structure is simple, but particles drop on the chip during assembly
Solution Approach 1:
The patent extracts and removes the threaded focusing mechanism from the camera module design. This elimination of the threaded component simplifies the overall structure by removing unnecessary parts while simultaneously preventing particle contamination during assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the stability and image quality by preventing particle contamination on the chip and reducing the module's size, making the assembly more convenient and compact while maintaining optical design integrity.
Implementation Method 1
the connecting portion is an adhesive layer made of AA glue
Data Source
AI summary
The present disclosure provides a mobile phone camera module, and relates to the field of cameras. The mobile phone camera module includes a bracket assembly having an accommodation cavity, a flexible circuit board fixed to a first side of the bracket assembly, a chip accommodated in the accommodation cavity and electrically connected to the flexible circuit board, a lens assembly disposed on a second side of the bracket assembly and disposed opposite to the flexible circuit board, and a connecting portion connecting the lens assembly to the second side of the bracket assembly. The connecting portion is disposed between the bracket assembly and the lens assembly. The present disclosure solves the problem that the particles drop directly on the surface of the chip during focusing assembly, thereby affecting the image quality.