Camera Module Adhesive Through-Holes for Focal Point Alignment
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Solution Overview
Problem
Camera modules in vehicles often face issues where the focal point of the lens is outside the design range during assembly, leading to potential deformation or damage of components, and existing assembly processes are complex and time-consuming.
Innovation Solution
A camera module design featuring a lens unit, a front body, a board unit with an image sensor, and a first adhesion unit, where the board unit is aligned using parallel movement or rotation to adjust the focal point within the image sensor's active region, and an adhesive is applied in a manner that allows air expansion during curing to prevent focal length deviations and component damage through strategically placed through-holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the camera module is assembled using conventional methods, then the assembly process is completed, but the focal point of the lens may be located out of the design range of the image sensor
Solution Approach 1:
The patent applies preliminary action by performing focal point adjustment through parallel movement or rotation of the board unit before final adhesive curing. This allows the focal point to be positioned within the design range of the image sensor prior to permanent fixation, preventing focal point location errors in the assembled camera module.
2Productivity
If the camera module is assembled using conventional methods, then the assembly is completed, but parts may be deformed or damaged during assembly
Solution Approach 1:
The patent applies preliminary action by performing alignment adjustments of the board unit (parallel movement or rotation) before final adhesive curing. This allows components to be positioned correctly while still adjustable, preventing deformation or damage that would occur if adjustments were attempted after rigid fixation.
Solution Approach 2:
The patent applies dynamics by allowing the board unit to undergo parallel movement or rotation during the assembly process before final fixation. This dynamic adjustment capability enables precise focal point positioning without applying excessive force that could damage components, and the system transitions from a movable state during assembly to a fixed state after curing.
3Strength
If the adhesive is applied in a continuous manner during assembly, then the bonding is strong, but air expansion during curing causes focal length deviations and component damage
Solution Approach 1:
The patent applies segmentation by dividing the adhesive application into discrete portions rather than continuous application. The adhesive is applied at specific locations between the front body and board unit, allowing air expansion during curing to occur without causing focal length deviations or component damage, while still achieving sufficient bonding strength.
Solution Approach 2:
The patent applies local quality by applying adhesive at specific strategic locations rather than uniformly across the entire bonding surface. This localized adhesive application provides sufficient bonding strength at critical areas while leaving space for air expansion in other areas, preventing focal length deviations and component damage during curing.
4Manufacturing precision
If the assembly process includes multiple adjustment and alignment steps, then the focal point positioning is accurate, but the assembly time and complexity increase
Solution Approach 1:
The patent applies dynamics by enabling the board unit to undergo parallel movement or rotation during assembly before final adhesive curing. This dynamic adjustment capability allows focal point positioning to be achieved through simple mechanical movements rather than complex multi-step alignment procedures, reducing assembly time while maintaining positioning accuracy.
Data Source
AI summary
A camera module includes a lens holder having a hollow region; a first lens unit disposed in the hollow region and including at least one lens; a second lens unit disposed above the lens holder; a circuit board disposed under the lens holder; an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder and the circuit board to each other. The adhesion unit includes an opening and a portion of an internal space formed by a coupling of the circuit board and the lens holder is to be open to an outside through the opening of the adhesion.