Camera Module Adhesive Venting and Reinforcement
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Solution Overview
Problem
The existing camera module manufacturing process requires a separate step to close the vent hole after curing, which increases the number of steps and can lead to stain deposition on the imaging element.
Innovation Solution
A camera module design where the frame and rigid flexible substrate are adhered using adhesive on all sides except the bonding section with the FPC drawer unit, allowing a vent hole to form and be closed by reinforcement resin, reducing the need for a dedicated post-sealing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate process is used to close the vent hole after curing, then the adhesion bonding is reliable, but the number of manufacturing steps increases
Solution Approach 1:
The patent combines the vent hole closing function with the reinforcement resin application process. The reinforcement resin is applied to cover the vent hole opening formed by the non-adhesive portion, thereby closing the vent hole while simultaneously reinforcing the bonding section. This merging of functions eliminates the need for a separate vent hole closing process, reducing manufacturing steps while maintaining bonding reliability.
2Device complexity
If the vent hole is not closed separately, then the manufacturing process is simplified, but dust may enter and cause black spot failure
Solution Approach 1:
The patent merges the vent hole closing function with the reinforcement resin application. The reinforcement resin covers the vent hole opening, preventing dust entry while simultaneously providing structural reinforcement. This eliminates the need for a separate closing process that could introduce contamination risks.
Solution Approach 2:
The reinforcement resin application serves dual purposes: closing the vent hole and reinforcing the bonding section. The process is self-sufficient, requiring no additional dedicated steps for vent hole management, thereby reducing overall process complexity while maintaining protection against dust contamination.
3Strength
If adhesive is applied on all abutment surfaces including bonding section with FPC drawer unit, then adhesion is complete, but vent hole cannot be formed for gas escape
Solution Approach 1:
The patent applies adhesive selectively to specific abutment surfaces while deliberately excluding the bonding section with the FPC drawer unit. This local quality approach ensures adequate adhesion strength at critical bonding areas while creating a non-adhesive portion that forms the vent hole for gas escape during curing.
Solution Approach 2:
The abutment surface is segmented into adhesive application areas and non-adhesive areas. The non-adhesive portion is specifically positioned at the bonding section with the FPC drawer unit to create the vent hole, while other areas receive adhesive for bonding. This segmentation enables both adhesion and venting functions to coexist.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the manufacturing steps and prevents dust from entering, thereby suppressing the generation of black spots due to dust deposition on the imaging element.
Implementation Method 1
since the gas of the space between the frame and the rigid flexible substrate is expanded at heating
Implementation Method 2
reinforcement resin configured to reinforce a bonding section between the rigid flexible substrate and the FPC drawer unit or reinforce a bonding section between the rigid flexible substrate and the frame is applied so as to cover the portion of the range on which the adhesive has not been applied
Data Source
AI summary
The present technology relates to a camera module capable of reducing the number of steps in the manufacturing process and reducing a black spot failure, a method for manufacturing the camera module, an imaging apparatus, and an electronic instrument. A frame and the rigid flexible substrate are adhered to each other by adhesive formed of thermosetting resin applied on an abutment surface excluding a portion of a range including a bonding section with the FPC drawer unit, thereby forming a vent hole in a site where adhesive has not been applied. At this time, the air of the space between the frame and the rigid flexible substrate is expanded by the heat and discharged from the vent hole. Subsequently, after adhesion is performed with thermosetting resin, reinforcement resin that reinforces the bonding section between the rigid flexible substrate and the FPC drawer unit or that reinforces the bonding section between the rigid flexible substrate and the frame is applied so as to close a portion of the range on which the adhesive has not been applied. This enables omitting the process of closing the vent hole. The present technology can be applied to a camera module.