Camera Module Air Discharge Through Hole for Sealing Reliability
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Solution Overview
Problem
The existing camera modules face issues with mechanical reliability due to air expansion and reduced adhesive strength between the IR filter and cover glass, leading to potential contamination and tilt, which compromises the sealing and functionality of the module.
Innovation Solution
A camera module design that incorporates a through hole structure, either in the first or second PCB, to discharge air between the IR filter and image sensor, ensuring stable adhesive strength and preventing tilt of the cover glass, thereby enhancing mechanical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the space between the image sensor and the IR filter is sealed, then foreign substances are prevented from entering, but air expansion during adhesive curing causes opened sealing and tilt between the IR filter and cover glass
Solution Approach 1:
The patent extracts the harmful air from the sealed space by providing a discharge path through the PCB. The through hole allows air to escape from the cavity during adhesive curing, preventing air expansion from causing sealing failure and alignment tilt, while the seal structure prevents foreign substance entry.
Solution Approach 2:
The patent introduces a seal structure as an intermediary component that selectively controls what can pass through the space between the image sensor and IR filter. The seal allows air to escape through the through hole while blocking foreign substances from entering, resolving the contradiction between sealing integrity and air discharge needs.
2Strength
If adhesive is used to bond the IR filter and cover glass, then the components are joined together, but adhesive strength reduction causes opened sealing and foreign substance inflow
Solution Approach 1:
The patent performs preliminary action by providing a air discharge path before the adhesive curing process begins. This allows air to escape during curing, preventing air expansion from reducing adhesive strength and causing sealing failure, thereby ensuring both strong bonding and reliable sealing.
3Volume of moving object
If the camera module is miniaturized with smaller pixel size and reduced height, then the module size is reduced, but mechanical reliability against tilt and shift deteriorates
Solution Approach 1:
The patent extracts the source of mechanical instability (air expansion) by providing a discharge path through the PCB. This prevents air from causing tilt and shift during adhesive curing, thereby maintaining mechanical reliability even in miniaturized modules with smaller pixels and reduced height.
4Strength
If the adhesive is thermally strengthened, then the bonding is enhanced, but air expansion during the process causes opened sealing and tilt
Solution Approach 1:
The patent extracts harmful air from the sealed cavity during thermal strengthening of the adhesive. The through hole provides a discharge path that allows air to escape while the adhesive cures, preventing air expansion from causing alignment tilt and sealing failure, thereby enabling strong bonding without compromising stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively stabilizes the adhesive strength between the IR filter and image sensor, preventing tilt and contamination, and significantly improves the mechanical reliability of the camera module.
Implementation Method 1
a first through hole taking a shape of a pipe that is connected at one end thereof to the window and connected at the other end to the cavity, the first through hole serving as a path for discharging air between the IR filter and the image sensor
Data Source
AI summary
Disclosed is a camera module, the module including an IR filter for filtering infrared rays, an image sensor located under the IR filter to convert an incident optic image into an electric signal, a first PCB having a window to permit passage of the optic image and a cavity extending downwards from the window to accommodate the image sensor, a predetermined portion of an upper portion of the cavity being electrically connected to a predetermined portion of an upper surface of the image sensor, and a first through hole taking a shape of a pipe that is connected at one end thereof to the window and connected at the other end to the cavity, the first through hole serving as a path for discharging air between the IR filter and the image sensor.