Camera Module Substrate Back-Face Component Stacking
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Solution Overview
Problem
The challenge is to reduce the size of camera modules in electronic devices while maintaining imaging quality, as current designs face obstacles in making devices more intelligent, lighter, and thinner due to the large size of camera modules and the need for more intelligent components.
Innovation Solution
The camera module design features a substrate with electronic components on the back face, a molding unit with a back molding portion that embeds components to prevent oxidation and interference, and a molding base that integrates with the substrate to reduce the module's length and width, allowing for more intelligent components to be accommodated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the camera module is configured with a photosensitive element of larger photosensitive area and more passive electronic components to improve imaging quality, then the imaging quality is improved, but the size of the camera module increases
Solution Approach 1:
The patent applies three-dimensional stacking arrangement where passive electronic components are disposed on different layers (first layer and second layer) above the circuit board, rather than arranging them in a single plane. This vertical arrangement in the height direction allows more components to be integrated without increasing the length and width of the camera module, effectively resolving the contradiction between component quantity and module size.
Solution Approach 2:
The patent implements nested arrangement where passive electronic components are stacked vertically one above another in multiple layers. The first passive electronic component is disposed on a first layer, and the second passive electronic component is disposed on a second layer above the first layer, creating a nested three-dimensional structure that maximizes space utilization and reduces the overall footprint of the camera module.
2Manufacturing precision
If passive electronic components are disposed around the photosensitive chip on the same side to avoid interference, then imaging quality is maintained, but the length and width of the camera module increase
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional spatial arrangement by disposing passive electronic components on multiple layers above the circuit board. This vertical stacking in the height direction eliminates the need to expand the length and width to accommodate additional components, while still maintaining adequate spacing to prevent mutual interference between adjacent passive electronic components.
Solution Approach 2:
The patent segments the arrangement space into multiple discrete layers (first layer and second layer) vertically separated above the circuit board. Each layer can independently accommodate passive electronic components with sufficient spacing, allowing the components to be distributed in three-dimensional space rather than constrained to a single plane, thereby reducing the overall area requirement.
3Adaptability or versatility
If more intelligent modules or mechanisms are configured for electronic products to make them more intelligent, then the intelligence of electronic products is improved, but the space available for other components is reduced
Solution Approach 1:
The patent utilizes the height direction (z-axis) for component arrangement, creating a three-dimensional layout where passive electronic components are stacked vertically above the circuit board. This approach consolidates the camera module's volume usage, reducing its length and width footprint, thereby freeing up horizontal space within the electronic device for additional intelligent modules or mechanisms.
Solution Approach 2:
The patent merges multiple passive electronic components into a compact three-dimensional arrangement above the circuit board, consolidating their spatial occupation. This efficient integration reduces the overall volume required for the camera module, creating more available space in the electronic device for configuring additional intelligent features or mechanisms.
Data Source
AI summary
The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.