Focus-Free Camera Module Barrel Adhesion
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Solution Overview
Problem
Conventional focus-free camera modules face de-focusing issues due to height deviations caused by uneven epoxy thickness between the optical system and the image sensor, leading to product defects.
Innovation Solution
A focus-free camera module design where the barrel is directly adhered to the image sensor using thermosetting epoxy resin, with the holder serving as a guide to determine the depth of focus, eliminating the influence of epoxy height deviation on focus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If epoxy is used to couple the image sensor with the housing mechanism, then the image sensor can be mounted, but height deviation occurs due to uneven epoxy thickness causing de-focusing
Solution Approach 1:
The housing mechanism is divided into a holder and a barrel. The holder is attached to the PCB with epoxy, while the barrel is separately positioned on the image sensor and then coupled to the holder. This segmentation allows the epoxy to only secure the holder to the PCB, eliminating its influence on the optical path height between the lens and image sensor.
Solution Approach 2:
The epoxy coupling function is extracted from the optical path. Instead of using epoxy to couple the image sensor directly to the housing mechanism (which affects height), the epoxy is used only to attach the holder to the PCB. The barrel is then mechanically coupled to the holder, removing epoxy's height-deviation-causing effect from the critical optical path.
2Ease of manufacture
If epoxy-coated amount is used to couple the image sensor, then mounting is achieved, but height deviation varies on each product creating de-focusing defects
Solution Approach 1:
The coupling system is segmented into two independent functions: the holder is coupled to the PCB using epoxy (non-critical for focus), and the barrel is mechanically positioned on the image sensor and coupled to the holder. This segmentation ensures that epoxy amount variations only affect holder positioning, not the critical optical height.
Solution Approach 2:
The epoxy coupling function is extracted from the optical path and relocated to the PCB-mounting interface. The barrel's position on the image sensor is determined by mechanical features (inner/outer circumferences) rather than epoxy, eliminating the link between epoxy amount and focus consistency.
3Ease of manufacture
If the barrel height is not precisely controlled, then assembly is easier, but de-focusing occurs due to height deviation between optical system and image sensor
Solution Approach 1:
The barrel's outer circumference serves a dual function: it is the structural component that determines height, and simultaneously serves as the positioning feature that fits into the holder's inner circumference. This self-positioning mechanism automatically ensures correct height without requiring external adjustment or complex assembly processes.
Solution Approach 2:
The holder's inner circumference and the barrel's outer circumference are designed with specific asymmetric dimensional relationships. The inner circumference of the holder is larger than the outer circumference of the barrel, creating a snap-fit or press-fit arrangement that automatically positions the barrel at the correct height on the image sensor without requiring precise external control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures that the depth of focus is solely determined by the barrel's mechanism height, minimizing de-focusing problems and enhancing product standardization and reducing defect rates.
Implementation Method 1
the adhesive means is a thermosetting resin
Implementation Method 2
the adhesive means is an epoxy
Data Source
AI summary
The present disclosure relates to a focus-free camera module minimized in height deviation of depth of focus, the focus-fixed focus-free camera module including: an image sensor; a PCB (Printed Circuit Board) mounted with the image sensor; a barrel mounted at an upper surface of the image sensor and accommodated with a lens therein; a holder attached to an upper surface of the PCB to accommodate the barrel; and adhesive means adhering an outer circumference of the barrel to an inner circumference of the holder, such that no height deviation in depth of focus is generated by adhesive structure in which a bottom distal end surface of the barrel is tightly adhered to an upper surface of an image sensor side without any separate medium.