Camera Module Base with Cutouts for Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization and reliability of camera modules in mobile phones with minimal or borderless designs are challenged by the need to reduce size while preventing light leakage, external particle intrusion, and electromagnetic interference.
Innovation Solution
The camera module design incorporates a base with a cutout for electronic components, a conductive heat dissipating adhesive for grounding and heat dissipation, and a protective film to secure the lens, which reduces size and prevents external interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic components are arranged around the photosensitive chip on the circuit board, then the camera module can be assembled with standard components, but the planar area of the camera module increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of electronic components around the photosensitive chip to a three-dimensional stacked configuration. The base is positioned below the circuit board, creating vertical layering that reduces the horizontal footprint while maintaining all necessary component connections and functionality.
Solution Approach 2:
The base with cutouts is designed to nest within or alongside the circuit board structure, with electronic components arranged to fit into the spatial envelope defined by both elements. This nested arrangement optimizes space utilization and minimizes the overall planar area occupied by the camera module.
2Area of stationary object
If the camera module is miniaturized to fit borderless mobile phones, then the device becomes more compact, but reliability against light leakage and external particle entry deteriorates
Solution Approach 1:
The patent employs a film structure that conforms to the minimized geometry of the camera module, providing continuous coverage for light and particle protection. This thin film approach maintains protective functionality while occupying minimal space that would be incompatible with miniaturization goals.
Solution Approach 2:
The base features asymmetric cutout patterns specifically designed to accommodate electronic components while maintaining continuous protective barriers in critical areas. The asymmetric design allows optimization of protection in light-sensitive directions while providing necessary access for component integration.
3Length of stationary object
If the camera module is miniaturized for thin-border mobile phones, then the device thickness is reduced, but protection against electromagnetic interference deteriorates
Solution Approach 1:
The patent utilizes composite material structures, particularly conductive adhesives that combine electrical conductivity with adhesive properties. These composite materials provide electromagnetic shielding functionality within the thinned profile by creating conductive pathways and barriers that block electromagnetic interference without requiring additional space.
Solution Approach 2:
The patent merges multiple functions into the base structure: mechanical support, electromagnetic shielding, and structural integration. The base with its cutouts serves simultaneously as a mounting structure for electronic components and as an electromagnetic barrier, eliminating the need for separate shielding layers that would increase thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively minimizes the camera module's size, prevents light leakage and external particle entry, and reduces electromagnetic interference, enhancing the reliability of camera modules in thin-border mobile phones.
Implementation Method 1
a conductive heat dissipating adhesive for grounding and heat dissipation
Implementation Method 2
a conductive heat dissipating adhesive for grounding and heat dissipation
Data Source
AI summary
A camera module includes a base, a circuit board bearing the base, and a metal plate bearing the circuit board and the base. The base includes a receiving portion and a bearing portion. The bearing portion surrounds the receiving portion. The bearing portion defines a cutout to receive an electronic component of the circuit board.