Camera Module Base Repositioning for Curing Stability
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Solution Overview
Problem
Conventional camera modules with handshake correction functions protrude from mobile devices due to increased length, and suffer from improper temporary curing during assembly, leading to stability issues and prolonged curing times.
Innovation Solution
A camera module design that minimizes optical axis length by positioning a base and circuit elements in a way that avoids overlap with the image sensor and current carrying parts, and includes a sensor base with a guide part for improved IR curing and adhesive application, allowing for a reduced Flange Back Length (FBL) and enhanced stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the base is positioned to avoid overlap with the image sensor and current carrying part, then the optical axis length is minimized, but the structural complexity increases
Solution Approach 1:
The base is repositioned from a conventional overlapping layout to a non-overlapping configuration in the optical axis direction, utilizing spatial arrangement in multiple dimensions to reduce the overall optical axis length while maintaining functional integrity of the image sensor and current carrying parts
2Reliability
If the sensor base includes a guide part for adhesive application, then the curing stability is improved, but the device complexity increases
Solution Approach 1:
A guide part is introduced as an intermediary structure on the sensor base that facilitates proper adhesive application and positioning. This guide structure ensures stable curing by controlling adhesive placement without requiring complex external fixtures or processes
3Length of moving object
If the Flange Back Length is reduced, then the overall camera module length is minimized, but the manufacturing precision requirements increase
Solution Approach 1:
The guide part on the sensor base performs preliminary positioning and alignment functions before the final assembly and curing process. This pre-positioning ensures that even with reduced Flange Back Length, the necessary alignment precision is achieved through the guide structure that directs adhesive and component placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the overall length of the camera module, improves curing stability, and increases productivity by shortening curing time while preventing over-dimensional errors in adhesive application.
Implementation Method 1
improve a curing stability of IR (Infrared) rays
Implementation Method 2
curing stability of IR (Infrared) rays and secure reliability for processing
Data Source
AI summary
The present disclosure relates to a camera module, the camera module including a circuit board, an image sensor disposed on an upper surface of the circuit board, a current carrying part electrically connecting the image sensor and the circuit board, and a base disposed on the upper surface of the circuit board, wherein the base is not overlapped with the image sensor and the current carrying part in a direction of an optical axis.