Camera Module Buffer Space to Protect Flip-Chip Bumps
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The risk of breakage of camera modules in smartphones and similar devices is high due to the thermal expansion of joining materials used to connect imaging elements, which applies strong forces to mechanically weak connection terminals, especially when the devices are subjected to impact.
Innovation Solution
A camera module design that includes an imaging element flip-chip mounted on a base with a joining material joined to the optical back surface, forming a space between the joining material and a back-surface-side member, thereby reducing the risk of breakage by acting as a buffer and preventing direct contact between the imaging element and the deformed back-surface-side member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If flip-chip mounting is used to reduce camera module height, then the module becomes thinner and lighter, but the connection terminals (bumps) become mechanically weak and more susceptible to damage
Solution Approach 1:
The buffer layer serves as beforehand cushioning for the mechanically weak bumps. By positioning the buffer layer in advance between the joining material and imaging element, the weak connection terminals are protected from impact forces and thermal expansion forces, compensating for their inherent mechanical weakness while maintaining the thin profile enabled by flip-chip mounting
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively lowers the risk of camera module breakage by absorbing impact and reducing the force applied to the imaging element, while maintaining electrical connectivity and allowing for a thinner, more compact module structure.
Implementation Method 1
the joining material thermally expands due to heat generated from the imaging element
Data Source
AI summary
The present technology relates to a camera module and an electronic apparatus that can lower the risk of breakage. An imaging element has a light receiving surface to receive light, and is flip-chip mounted on a base. A joining material is joined to the optical back surface of the imaging element so that a space is formed between the joining material and a back-surface-side member provided on the side of the optical back surface on the opposite side of the imaging element from the light receiving surface. The present technology can be applied to camera modules and the like that capture images, for example.