Camera Module With Embedded Conductive Dielectric For Larger Dies
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Solution Overview
Problem
Current camera modules face challenges in accommodating larger dies due to space constraints for wire bonding and surface mount devices (SMDs) as the die size increases, limiting the miniaturization of mobile terminals while maintaining high-quality image capture.
Innovation Solution
A low-profile chip scale module design that eliminates bonding wires by integrating a conductive material within a dielectric material to couple SMDs and dies, allowing for larger die sizes and embedding SMDs on the same plane as the die, with integrated electromagnetic shielding and system integration capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wire bonding and SMD placement are used in traditional camera modules, then electrical connections are established, but the die size is limited and module dimensions increase
Solution Approach 1:
The patent merges the electrical connection function into the dielectric material itself by embedding conductive materials within the dielectric structure. This integration eliminates the need for separate wire bonding and SMD components, allowing larger dies to be accommodated while reducing overall module dimensions. The conductive traces are formed directly within the dielectric layers, creating a compact integrated structure.
Solution Approach 2:
The patent transitions from a planar arrangement where SMDs are placed on the substrate surface to a three-dimensional structure where conductive materials are embedded within multiple dielectric layers. This vertical integration allows electrical connections to be established through the thickness of the module rather than requiring lateral space, enabling larger dies and reducing the module footprint.
2Area of stationary object
If bonding wires are used to connect the die, then electrical connections are established, but space is consumed that could be used for larger dies
Solution Approach 1:
The patent extracts the bonding wire function from the traditional wire bonding process and integrates it directly into the dielectric material structure. Conductive traces are formed within the dielectric layers, eliminating the need for separate bonding wires and freeing up valuable die area for active elements while reducing structural complexity.
Solution Approach 2:
The dielectric material serves as an intermediary that simultaneously provides electrical insulation and contains embedded conductive pathways. This eliminates the need for separate bonding wires while maintaining electrical connectivity, thereby increasing the available die area and simplifying the overall structure.
3Length of stationary object
If SMDs are placed on the substrate, then passive components are integrated, but the module profile increases and space is consumed
Solution Approach 1:
The patent embeds conductive materials and passive component structures within the dielectric layers, creating a nested configuration where functional elements are contained within the bulk of the dielectric material rather than being mounted on the surface. This reduces the module profile while maintaining component integration capability.
Solution Approach 2:
The patent moves component integration from the lateral dimension (SMDs on substrate surface) to the vertical dimension (conductive traces and embedded structures within dielectric layers). This three-dimensional integration reduces the module profile height while preserving electrical connectivity and passive component functionality.
4Manufacturing precision
If larger dies are used to improve image quality, then image capture quality increases, but wire bonding and SMD placement space becomes insufficient
Solution Approach 1:
The patent merges the electrical connection functionality into the dielectric material structure, eliminating the need for separate wire bonding and SMD placement areas. This allows the entire die surface to be utilized for active imaging elements, enabling larger dies that improve image capture quality without sacrificing connection space.
Data Source
AI summary
A low profile chip scale module and method of making of the same. The low profile chip scale module includes embedded SMD and integrated EM shielding. An adhesive layer is arranged on a substrate, e.g., chip carrier. Dies and SMDs are arranged on the adhesive layer. An etched frame and molding is attached to the substrate. Inputs/outputs (I/O) are formed and the substrate is coated with a dielectric material. Metal lines and connections among bond pads are formed and another layer of dielectric material is applied as a protective layer. The substrate is cut into various predetermined sizes and a lens is attached to form the chip scale module.