Conductive Housing for Camera Module EM Shielding

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Solution Overview

Problem

Conventional camera modules face challenges in effectively shielding electromagnetic waves due to dimensional variance sensitivity and complex epoxy processes when using conductive housings, which affect electromagnetic compatibility and increase fabrication costs.

Innovation Solution

A camera module design featuring a conductive housing bonded to a chip-scale image sensor package with a ground pad, where the housing is in contact with the ground pad and extends to form an aperture, and a method involving wafer stacking and trench filling with a conductive material to simplify fabrication and enhance EM wave shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductive housing is used to shield electromagnetic waves, then electromagnetic compatibility is improved, but sensitivity to dimensional variance increases and fabrication complexity increases

Engineering Contradiction:

Improveelectromagnetic compatibilityVSAvoiddimensional variance sensitivity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The housing is divided into a first housing portion and a second housing portion that are separately formed and then assembled together. This segmentation allows each portion to be manufactured with relaxed dimensional tolerances, reducing sensitivity to dimensional variance while maintaining effective EM wave shielding when assembled.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The image sensor chip is embedded within the housing structure, with the conductive housing portions assembled around it. This nesting approach allows the housing to effectively shield the embedded chip without requiring precise dimensional control of the entire assembly as a single unit.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If a conductive housing is used to shield electromagnetic waves, then electromagnetic compatibility is improved, but fabrication process complexity increases due to epoxy processes

Engineering Contradiction:

Improveelectromagnetic compatibilityVSAvoidfabrication process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The housing is segmented into multiple portions that can be manufactured using standard molding processes without requiring complex epoxy application steps. This segmentation simplifies the fabrication process while maintaining effective EM shielding.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention replaces the chemical epoxy bonding process with a mechanical assembly approach where housing portions are fitted together. This substitution eliminates the need for complex epoxy processes while achieving effective assembly and EM wave shielding.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If conventional separate component fabrication is used, then manufacturing flexibility is maintained, but downscaling of the camera module becomes difficult and costs increase

Engineering Contradiction:

Improvedownscaling capabilityVSAvoidfabrication cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The housing portions and image sensor chip are integrated into a unified structure where the chip is embedded within the housing. This merging enables downscaling of the overall module while reducing fabrication costs through streamlined manufacturing processes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention transitions from planar separate component arrangement to a three-dimensional integrated structure where the image sensor chip is embedded within the housing volume. This dimensional change enables effective downscaling of the camera module while maintaining manufacturing efficiency.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively shields electromagnetic waves, reduces sensitivity to dimensional variance, and simplifies the fabrication process by eliminating the need for complex epoxy processes, thereby improving electromagnetic compatibility and reducing manufacturing costs.

Implementation Method 1

camera modules including housings capable of effectively shielding electromagnetic (EM) waves

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS8114701B2Camera modules and methods of fabricating the same

Publication Date: 2012.02.14 SAMSUNG ELECTRONICS CO LTD

AI summary

Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.