Camera Module Conductive Plate for Heat Dissipation and EMI Grounding

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Solution Overview

Problem

Electromagnetic interference and heat dissipation issues arise in electronic devices due to the increasing miniaturization and performance of camera modules, leading to signal malfunctions and reduced image quality.

Innovation Solution

A camera module design featuring a conductive plate between the printed circuit board and image sensor, connected to a shield can and conductive pad, which dissipates heat and shields electromagnetic waves by grounding the actuator.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the camera module performance is improved with higher resolution and pixels, then image quality is improved, but electromagnetic interference and heat dissipation problems worsen

Engineering Contradiction:
Improveimage qualityVSAvoidelectromagnetic interference
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

A conductive plate is introduced as an intermediary component between the image sensor and the printed circuit board. This conductive plate serves multiple functions: it acts as a ground plane to shield electromagnetic waves generated by the actuator, provides a heat dissipation path for the image sensor, and maintains electrical connectivity without requiring the image sensor to be directly mounted on the PCB trace layers.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If the camera module performance is improved with higher resolution and pixels, then image quality is improved, but heat dissipation problems worsen

Engineering Contradiction:
Improveimage qualityVSAvoidheat dissipation
Core Design Contradiction:
Measurement precisionVSTemperature

Solution Approach 1:

The conductive plate functions as a thermal intermediary, conducting heat away from the image sensor to the printed circuit board and surrounding structures. This separates the thermal management function from the electrical mounting function, allowing the image sensor to be effectively cooled without compromising its electrical connection or the PCB layout.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Volume of moving object

If the distance between electronic components is reduced for miniaturization, then device size is reduced, but electromagnetic interference between components worsens

Engineering Contradiction:
Improvedevice sizeVSAvoidelectromagnetic interference
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The conductive plate acts as an electromagnetic shield in the miniaturized camera module, blocking the electromagnetic waves generated by the actuator from interfering with other nearby electronic components. This allows components to be placed closer together without suffering from increased EMI, thus achieving miniaturization while maintaining signal integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively shields electromagnetic interference and enhances heat dissipation, improving the operational stability and image quality of the camera module.

Implementation Method 1

the conductive plate may be configured to emit heat generated from the image sensor to an outside of the camera module by contact with the image sensor

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the camera module for heat dissipation and ground can effectively shield electromagnetic waves generated when the actuator is driven

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS12363406B2Camera module for heat dissipation and ground and electronic device including the same
Publication Date: 2025.07.15 SAMSUNG ELECTRONICS CO LTD
  • US12363406B2 patent drawing
  • US12363406B2 patent drawing
  • US12363406B2 patent drawing

AI summary

A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.