Camera Module Connecting Pin Radial Deformation
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Solution Overview
Problem
Camera modules face challenges in achieving a space-saving connection between the circuit board and the objective holder that provides excellent thermal conduction and holding properties, while minimizing the risk of damage to the image sensor and reducing the need for additional components or space.
Innovation Solution
A method involving a connecting pin that is widened using a forming die to create a radially acting deformation force, pressing the base plate and objective holder together, thereby producing a positive connection with improved thermal conduction and stability, eliminating the need for screws, bonding layers, and reducing component thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection methods (screws, bonding, welding) are used to connect the base plate and objective holder, then reliable connection is achieved, but the device complexity and space requirements increase
Solution Approach 1:
The invention extracts the connection function from complex multi-component fastening systems (screws, bonding layers, additional positioning elements) and consolidates it into a single integrated connecting pin that performs both positioning and fastening functions, thereby reducing device complexity while maintaining connection reliability
Solution Approach 2:
The connecting pin serves multiple functions simultaneously: it acts as a positioning element, a fastening element, and a thermal conduction path. This multi-functionality eliminates the need for separate components, reducing overall device complexity while ensuring reliable connection
2Stability of the object's composition
If screws or bonded connections are used, then connection stability is achieved, but the production time and manufacturing complexity increase
Solution Approach 1:
The connecting pin is pre-formed with a specific geometry that enables self-positioning and self-fastening. The pin is inserted in a preliminary action that automatically achieves both positioning and connection stability without requiring subsequent tightening or bonding operations, thereby increasing production speed
Solution Approach 2:
The connecting pin is designed to perform its own positioning and fastening functions through its geometric shape. When inserted, it automatically aligns the base plate and objective holder and creates a stable connection through its own structural features, eliminating the need for additional fastening operations and improving productivity
3Strength
If additional fastening components are used, then connection strength is achieved, but the wall thickness requirements and space consumption increase
Solution Approach 1:
The connecting pin utilizes radial deformation at its free end to create a friction grip within the recess. This dimensional approach transforms the connection from relying on axial thread engagement (requiring thick walls) to relying on radial expansion within the recess space, thereby reducing wall thickness requirements while maintaining connection strength
4Temperature
If bonding layers are used for connection, then thermal conduction is improved, but the connection space and manufacturing complexity increase
Solution Approach 1:
The invention removes the bonding layer from the connection system and replaces it with direct metal-to-metal contact through the connecting pin and recess interface. This extraction eliminates the thermal insulation effect of bonding layers while simplifying manufacturing by removing the bonding process entirely
Solution Approach 2:
The invention replaces the chemical bonding mechanism with a mechanical friction grip mechanism. The connecting pin's radially deformed free end creates a positive mechanical connection through friction and geometric interlocking, providing both structural strength and thermal conduction without requiring bonding materials or processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method results in a space-optimized camera module with enhanced thermal conduction and stability, faster and more economical production compared to welding, and reduced risk of image sensor damage, while allowing for exact positioning without additional joining parts.
Implementation Method 1
The at least one free end of the connecting pin is widened by a forming die using a radially acting deformation force such that the base plate and the objective holder are pressed against each other
Implementation Method 2
An axial contact pressure is thus applied in a connection region in which the base plate and the objective holder rest against each other
Implementation Method 3
produce a space-saving connection between the circuit board and the objective holder/housing that provides excellent thermal conduction and holding properties
Data Source
AI summary
A method for joining a camera module, which includes a base plate on which an image sensor is situated, and an objective holder in which an objective of the camera module is accommodated. The base plate and the objective holder are aligned relative to each other in a connection region and a connecting pin is guided through a recess of the base plate and/or the objective holder so that the connecting pin protrudes on the outside, and the at least one free end of the connecting pin is widened by a forming die using a radially acting deformation force such that the base plate and the objective holder are pressed against each other.