Camera Module Connection Frame for Compact Electronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As electronic devices transition to full screen designs, the reduced frame area poses challenges in compactly arranging camera modules, leading to exposed wires and contamination risks during glue injection processes, which lowers production yield.
Innovation Solution
A camera module design featuring a connection frame that electrically connects the chip and circuit board, eliminating the need for exposed wires, using a lead wire affixed to the connection frame with gold bump welding and conductive adhesive layers for stable connections, and an insulating adhesive layer for chip fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the base is cancelled to reduce camera module size, then the camera module size is reduced, but the wires become exposed and vulnerable to damage
Solution Approach 1:
The connection frame serves as an intermediary structure that provides mechanical support and protection for the wires connecting the image sensor to the circuit board. The frame body encloses the wires while the lead wires provide electrical connection, eliminating the need for a traditional base structure.
Solution Approach 2:
The connection frame performs multiple functions simultaneously: it provides structural support, protects exposed wires, establishes electrical connections through lead wires, and positions the image sensor. This multi-functionality replaces the traditional base while reducing overall module size.
2Reliability
If glue injection is performed to protect wires, then wire protection is improved, but dust is produced that contaminates the image sensor and reduces yield
Solution Approach 1:
The connection frame acts as a protective intermediary structure that encloses and protects the wires without requiring glue injection. This eliminates the source of dust contamination while maintaining wire protection, thereby improving production yield.
Solution Approach 2:
The invention extracts and eliminates the glue injection process from the manufacturing workflow by providing an alternative wire protection mechanism through the connection frame structure, thereby removing the harmful dust generation step.
3Reliability
If a connection frame is introduced to protect wires, then wire protection is improved, but device complexity increases
Solution Approach 1:
The connection frame integrates multiple functions into a single component: structural support, wire protection, electrical connection through integrated lead wires, and sensor positioning. This consolidation reduces the number of separate components needed despite adding protective functionality.
Solution Approach 2:
The connection frame merges the functions of the traditional base structure with the electrical connection system. The lead wires are integrated directly onto the frame body, combining mechanical support and electrical connection functions into one unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances production yield by preventing wire contamination and ensuring reliable electrical connections without glue injection, while allowing for a compact camera module structure.
Implementation Method 1
The bottom end of the enclosure frame and the circuit board are fixedly connected by a conductive adhesive layer, and the conductive adhesive layer is electrically connected with the pins at the other end of the lead wire
Implementation Method 2
The pins at one end of the lead wire are connected with the chip through gold bump welding
Implementation Method 3
an adhesive connection layer is filled between the inner wall of the enclosure frame and the side wall of the chip
Implementation Method 4
the bottom surface of the chip is fixedly connected with the circuit board through an insulating adhesive layer
Data Source
Figure 1~2
Figure 3
AI summary
The invention provides a camera module of an electronic device, which includes a circuit board, a chip, an image sensor and a connection frame. The chip is arranged on the circuit board, and the image sensor is arranged on the chip. The connection frame is arranged on the periphery of the chip, and the chip is electrically connected with the circuit board by the connection frame, and the image sensor is located in the space surrounded by the connection frame. The invention also provides an electronic device.