Camera Module Segmentation for Flexible Diffuser Changes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing camera module designs face challenges in manufacturing cost increases due to design changes, contamination from SMT processes, and potential collisions during wire bonding, particularly in stereoscopic image capture systems.
Innovation Solution
A camera module design that separates the light emitter and diffusion unit, allowing for independent design changes to the diffusion unit without affecting the entire package, and uses wire bonding to connect components, preventing contamination and collisions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the light emitter and diffusion unit are integrated in a single package, then the structure is compact, but design changes to the diffusion unit require repackaging and increase manufacturing costs
Solution Approach 1:
The patent divides the light emitter package into two independent parts: the light emitter unit and the diffusion unit. This segmentation allows the diffusion unit to be designed and manufactured separately from the light emitter, enabling design changes without requiring repackaging of the entire assembly, thus reducing manufacturing costs while maintaining flexibility.
2Productivity
If SMT process is used to assemble components, then assembly efficiency is improved, but contamination and foreign substance generation occur
Solution Approach 1:
The patent introduces a carrier substrate as an intermediary component that holds the light emitter and diffusion unit during assembly. This carrier substrate enables precise positioning and secure mounting without requiring direct SMT processes that generate contamination, thereby maintaining assembly efficiency while preventing foreign substance generation.
3Device complexity
If wire bonding is performed without protective structures, then the process is simple, but gripper collision damages components
Solution Approach 1:
The patent incorporates a protective structure (such as a protective cap or housing element) that is positioned in advance to shield the light emitter and diffusion unit from gripper collision during wire bonding operations. This pre-established protection prevents component damage while maintaining process simplicity by not requiring complex additional steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates design flexibility without increasing manufacturing costs, prevents contamination, and ensures reliable component connections, enhancing the reliability and efficiency of stereoscopic image capture.
Implementation Method 1
a light emitter configured to emit light to an object and a light receiver configured to receive the light reflected from the object
Implementation Method 2
the light emitter and the diffusion unit, wherein the light emitter is disposed on the substrate and the diffusion unit is coupled to the light emitter
Data Source
Figure 1~2
Figure 3~5
Figure 6~7
AI summary
An embodiment comprises: a substrate; a light emitting unit including a light emitting diode disposed on the substrate; a light receiving unit including a lens barrel and a sensor; a case housing the light emitting unit; a diffusing unit coupled to the case and disposed above the light emitting unit; a circuit substrate coupled to the substrate and the sensor; a first wire electrically connecting the light emitting unit and the substrate; and a second wire electrically connecting the substrate and the circuit substrate.