Camera Module Dovetail Mounting Reduces Light Leakage
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Solution Overview
Problem
Current camera modules face challenges in meeting miniaturization and optical requirements due to restricted adhesive material selections, which affect mechanical strength and light leakage.
Innovation Solution
The use of a dovetailed arrangement of bumps and gaps on the mounting bracket and printed circuit board, combined with a reinforced adhesive, enhances mechanical strength and reduces light leakage, allowing for a broader range of adhesive options and potentially lower costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical adhesives are used to mount the base to the circuit board, then the camera module can be assembled, but the adhesive material selections are restricted due to miniaturization requirements and optical properties
Solution Approach 1:
The mounting bracket is segmented with multiple bumps protruding from its bottom surface, and the circuit board has corresponding gaps. This segmentation allows the adhesive to be applied only at specific locations (on the bumps), reducing the total adhesive volume and relaxing miniaturization constraints while maintaining assembly capability.
Solution Approach 2:
The bumps act as intermediaries between the mounting bracket and circuit board. They provide mechanical support and positioning, allowing the adhesive to focus on bonding rather than structural support, which expands adhesive material options while meeting precision requirements.
2Strength
If conventional adhesive mounting is used, then assembly is simple, but mechanical strength is insufficient
Solution Approach 1:
The mounting structure combines mechanical features (bumps and gaps) with adhesive bonding, creating a composite mounting system. The bumps provide mechanical interlocking strength while the adhesive provides bonding, achieving high mechanical strength without excessive structural complexity.
Solution Approach 2:
The bumps are pre-formed on the mounting bracket before assembly. This preliminary action provides built-in mechanical support and positioning, reducing the burden on the adhesive and enhancing overall mechanical strength while keeping the assembly process simple.
3Object-affected harmful factors
If the base is mounted directly to the circuit board, then assembly is straightforward, but light leakage occurs
Solution Approach 1:
The gaps in the circuit board are strategically positioned at locations where light leakage would occur. This local quality approach addresses light leakage only where needed, without requiring complex assembly modifications throughout the entire structure, maintaining ease of manufacture while eliminating harmful light leakage.
Data Source
AI summary
A camera module has a reduced light leakage. The camera module includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. Gaps are formed on the printed circuit board. The gaps extend from the first surface to a thickness direction of the first surface. Bumps are formed on the mounting bracket and correspondingly placed according to the gaps. Each of the bumps is received and fixed in a corresponding one of the gaps.