Camera Module Dustproof Layer for Image Quality
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Camera modules are prone to dust and impurity accumulation, which can lead to image staining and contamination when the module is shaken or dropped, due to the lack of effective protection for the filter and photosensitive chip.
Innovation Solution
A dustproof layer is integrated onto the circuit board, specifically designed to absorb pollutants, dust, and impurities, forming a protective barrier between the photosensitive chip and the environment, preventing contamination and improving image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the lens is installed in the lens holder without additional protection, then the assembly is simple, but dust and impurities can be easily gathered leading to image staining
Solution Approach 1:
The patent applies a dustproof film (thin film) covering the photosensitive chip and filter areas. This film prevents dust and impurities from contacting these components while maintaining a relatively simple overall structure. The film is integrated into the circuit board assembly, providing protection without requiring complex additional structures.
Solution Approach 2:
The dustproof film acts as an intermediary barrier between the external environment (dust, impurities) and the sensitive components (photosensitive chip, filter). This mediator layer prevents direct contact between harmful particles and the components that would cause image staining, while allowing light to pass through to the photosensitive chip.
2Reliability
If the filter is exposed without protection, then the structure is simple, but dust and impurities fall on the filter causing image staining
Solution Approach 1:
The dustproof film is positioned to cover the filter area, creating a protective barrier that prevents dust and impurities from settling on the filter. This maintains image quality by ensuring the filter remains clean, while the film itself is a simple thin-layer addition rather than a complex structure.
Solution Approach 2:
The dustproof film serves as an intermediary layer between the filter and the external environment. It prevents direct deposition of dust and impurities on the filter surface, thereby maintaining the filter's optical properties and preventing image staining.
3Reliability
If the photosensitive chip is exposed without protection, then the assembly is simple, but dust and impurities will rise and fall when the camera module is shaken or dropped
Solution Approach 1:
The dustproof film directly covers the photosensitive chip, preventing dust and impurities from settling on its surface. This is particularly important for maintaining image quality during movement, as the film secures the chip area against particle contamination even when the module is shaken or dropped.
Solution Approach 2:
The dustproof film acts as a protective intermediary between the photosensitive chip and airborne particles. During mechanical stress events like shaking or dropping, the film prevents particles from rising and falling onto the chip surface, ensuring consistent image quality regardless of module movement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dustproof layer effectively prevents contamination of the photosensitive chip and enhances imaging quality by absorbing and purifying airborne particles, ensuring clear images even under mechanical stress.
Implementation Method 1
A dustproof layer is integrated onto the circuit board, specifically designed to absorb pollutants, dust, and impurities
Data Source
AI summary
A camera module includes a circuit board, a photosensitive chip, a filter, a l holder, and a lens assembly. A receiving groove is recessed from a surface of the circuit board. The photosensitive chip is received in the receiving groove. The holder is mounted on the surface of the circuit board and covers the photosensitive chip. The filter is mounted in the holder and spaced from the photosensitive chip. The lens assembly is mounted on the holder and located at a side of the filter facing away from the photosensitive chip. A dustproof layer is laid on the surface of the circuit board facing the filter and surrounds the photosensitive chip. An electronic device having the camera module is also provided.