Camera Module Heat Dissipation via Embossed Protective Cover
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Solution Overview
Problem
As camera modules are miniaturized and pixel density increases, heat dissipation becomes challenging due to reduced space between components, leading to elevated temperatures that can degrade image resolution and introduce noise, with existing solutions relying on expensive ceramic materials that are difficult to implement effectively.
Innovation Solution
A camera module design incorporating a flex PCB circuit substrate, a protective cover made of heat-conductive materials with embossing for enhanced heat transfer, and a shield can to dissipate heat generated from the image sensor, reducing the need for expensive ceramic materials and allowing for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the camera module is miniaturized and pixel density is increased, then the resolution and compactness are improved, but heat dissipation becomes difficult and temperature increases
Solution Approach 1:
The patent segments the heat dissipation function into multiple components: the circuit substrate provides base heat conduction, the protective cover with embossing parts creates extended heat transfer surfaces, and the shield can with opening parts facilitates heat release. This segmented approach allows effective heat dissipation in a miniaturized structure without compromising resolution.
Solution Approach 2:
The patent introduces vertical dimensionality through embossing parts on the protective cover that extend upward, creating additional heat transfer surfaces in the vertical direction. This allows increased heat dissipation surface area without increasing the horizontal footprint, thus maintaining compactness while improving heat dissipation.
2Temperature
If expensive ceramic heat dissipation materials are used, then heat dissipation performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive ceramic heat dissipation materials with a cost-effective combination of standard materials: the protective cover made of heat-conductive material and the shield can with opening parts. This substitution maintains heat dissipation functionality while significantly reducing manufacturing costs.
Solution Approach 2:
The patent creates a composite heat dissipation system combining the protective cover with embossing parts, the shield can with opening parts, and the circuit substrate. This composite structure achieves ceramic-level heat dissipation performance using more economical materials and manufacturing processes.
3Volume of moving object
If the interval between patterns is reduced to save space, then compactness is improved, but heat generation increases
Solution Approach 1:
The patent introduces the protective cover with embossing parts as an intermediary heat transfer component between the circuit substrate and the external environment. This intermediary structure facilitates efficient heat transfer from the densely packed patterns, allowing compact design while managing heat generation from reduced spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the camera module's temperature, prevents heat-related defects, and maintains image quality while minimizing costs by using cost-effective materials and structures for heat dissipation, similar to ceramic-based solutions without the expense.
Implementation Method 1
a heat transfer member mounted in the image sensor to transfer heat generated from the image sensor
Implementation Method 2
The protective cover may be made of a heat conductive material
Data Source
AI summary
There is provided a camera module including a lens barrel, a housing, an IR filter, an image sensor, a circuit substrate, a shield can, a heat transfer member mounted in the image sensor to transfer heat generated from the image sensor, and a protective cover mounted between the housing and the shield can while surrounding the bottom of the heat transfer member and connecting the housing and the shield can.