Camera Module Encapsulation for Dust Protection and Thickness Reduction
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Solution Overview
Problem
Conventional camera module assembly techniques face challenges in achieving a thinner and lighter design due to issues such as exposed circuit components, dust contamination, increased thickness from frame mounting, poor evenness and flatness of the frame, and difficulty in reducing overall size, which affect image quality and production yield.
Innovation Solution
The integration of an encapsulation portion that molds onto the circuit board and photosensitive sensor, encapsulating circuit elements and connecting elements, providing a protective frame that prevents exposure and contamination, enhances structural strength, and allows for flexible design adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If circuit components and gold wires are directly exposed on the circuit board surface, then electrical connection is achieved, but dust and pollutants easily stick to them causing dark spots and increasing defective rate
Solution Approach 1:
The patent applies a protective frame structure that covers and encloses the circuit board, photosensitive sensor, and connecting elements. This frame acts as a protective shell that prevents dust and pollutants from contacting the exposed circuit components and gold wires, thereby eliminating the source of dark spots and reducing defective rate while maintaining electrical connectivity.
Solution Approach 2:
The patent implements a nested structure where the photosensitive sensor is mounted on the circuit board, both are enclosed within the protective frame. The frame contains the circuit board which in turn holds the sensor and connecting elements, creating a hierarchical nesting arrangement that protects internal components from external contamination.
2Ease of manufacture
If a safe distance is reserved between the frame and circuit components in horizontal and upward directions, then frame mounting is enabled, but the thickness of the camera module increases
Solution Approach 1:
The patent repositions the protective frame from the traditional outer side mounting to an inner side mounting configuration. The frame is arranged on the inner side of the circuit board rather than the outer side, changing the spatial dimension of frame placement. This allows the frame to overlap with circuit components in the horizontal direction while minimizing vertical thickness increase, as the frame structure utilizes the available internal space more efficiently.
3Measurement precision
If Active Arrangement technique is used to align sensor and camera lens central axes, then alignment precision is achieved, but more adhesive material and adjustment space are required increasing thickness
Solution Approach 1:
The patent implements preliminary alignment features directly into the protective frame structure during manufacturing. The frame includes pre-formed positioning structures, guide slots, or alignment marks that ensure the photosensitive sensor and camera lens are pre-aligned in the correct positional relationship before final assembly. This preliminary action eliminates or reduces the need for post-assembly Active Arrangement adjustments, thereby reducing the required adhesive material and adjustment space.
Solution Approach 2:
The protective frame serves multiple functions simultaneously: it provides mechanical protection, structural support, dust prevention, and alignment reference. The frame integrates alignment features that guide both the sensor and lens positioning, making the alignment function inherent to the frame structure rather than a separate process step, thereby reducing the need for additional adhesive material and adjustment space.
4Productivity
If the frame is made through injection molding technique, then manufacturing efficiency is improved, but the evenness and flatness of the frame surface are relatively poor affecting bonding stability
Solution Approach 1:
The patent modifies the injection molding process parameters to improve frame surface quality. This includes optimizing injection pressure, temperature, cooling rate, and mold design to achieve better surface evenness and flatness. By changing these manufacturing parameters, the frame maintains the benefits of injection molding (high productivity) while achieving the required surface precision for stable bonding with the circuit board and other components.
Solution Approach 2:
The patent may employ composite materials or multi-layer frame structures that combine materials with different properties. For example, using a rigid base material for structural strength combined with a surface layer that provides improved evenness and flatness. This composite approach allows the frame to be manufactured efficiently through injection molding while achieving the required surface quality for stable bonding.
Data Source
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AI summary
A camera module and photosensitive component and manufacturing method thereof. The photosensitive component includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.