Camera Module Encapsulation for Thickness and Reliability

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional Chip On Board (COB) technology for camera module assembly faces challenges in achieving a lighter and thinner design due to exposed circuit components and gold wires, leading to issues like dust contamination, increased thickness, and difficulty in maintaining image quality in multi-lens camera modules.

Innovation Solution

The camera module incorporates a photosensitive unit with an encapsulation portion that molds around the sensor and circuit elements, encapsulating connecting elements and optical filters to prevent exposure and reduce module thickness, while enhancing structural strength and thermal dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional COB technology is used with exposed circuit components and gold wires, then electrical connectivity is achieved, but the module thickness increases and image quality deteriorates due to dust contamination

Engineering Contradiction:

Improveimage qualityVSAvoidmodule thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent implements nesting by placing the circuit board inside a lens holder cavity, and further enclosing sensitive components within protective housings. The sensor is mounted on the circuit board which is then inserted into the lens holder, creating nested layers that reduce overall thickness while protecting internal components from dust contamination.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent uses thin protective films and enclosed housings to seal the circuit board and gold wires. By enclosing the circuit board within the lens holder and using protective coverings, the design prevents dust from reaching sensitive components while maintaining a compact thickness profile.

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If circuit components are mounted on the circuit board surface, then electrical functionality is achieved, but dust contamination increases affecting sensor performance

Engineering Contradiction:

Improvesensor performanceVSAvoiddust contamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The circuit board with mounted components is nested inside the lens holder cavity, creating a protected internal environment. This nesting structure physically isolates the circuit components and gold wires from external dust particles, preventing contamination that would otherwise affect sensor performance.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

Protective enclosures and thin film coverings are used to seal the circuit board area. The lens holder acts as a protective shell that encloses the circuit board and its components, preventing dust from reaching the sensor while maintaining electrical functionality.

Inventive Principle:

Principle #30Flexible shells and thin films

3Ease of manufacture

If lens holder is positioned at outer side around circuit components, then assembly is simplified, but module thickness increases

Engineering Contradiction:

Improveassembly simplicityVSAvoidmodule thickness

Core Design Contradiction:

Ease of manufactureVSLength of stationary object

Solution Approach 1:

The circuit board is nested inside the lens holder cavity rather than positioning the lens holder externally around components. This inverted nesting approach allows the lens holder to serve dual purposes: structural support and dust protection, while reducing the overall thickness compared to external positioning.

Inventive Principle:

Principle #7Nested doll (Nesting)

4Manufacturing precision

If multiple adhesive layers are used for alignment adjustment, then positioning precision is improved, but module thickness increases and manufacturing complexity increases

Engineering Contradiction:

Improvealignment precisionVSAvoidmodule thickness

Core Design Contradiction:

Manufacturing precisionVSLength of stationary object

Solution Approach 1:

Alignment marks and positioning features are pre-formed on the circuit board and lens holder during manufacturing. This preliminary action enables precise alignment to be achieved through mechanical positioning rather than requiring multiple adhesive layers for adjustment, thereby reducing thickness while maintaining manufacturing precision.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS10192914B2Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Publication Date: 2019.01.29 NINGBO SUNNY OPOTECH CO LTD

AI summary

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.