Camera Module Flexible Board Thermal Isolation
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Solution Overview
Problem
Existing camera modules face challenges in effectively dissipating heat generated by electronic components, leading to increased dark current in image sensors and reduced image quality due to thermal noise, especially in high-performance applications where power supply and signal processing demands are high.
Innovation Solution
The camera module design incorporates a flexible board that electrically connects the image sensor assembly and terminal, allowing for the dispersion of electronic components, including a power supply and signal processing units, away from the image sensor. This design includes a flexible board with extending parts that mount electronic components on the rear and side surfaces of the housing, reducing heat transfer to the image sensor and improving heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electronic components are mounted close to the image sensor for compact design, then device complexity is reduced, but heat transfer to the image sensor increases causing thermal noise and reduced image quality
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of components to a three-dimensional spatial configuration by extending the flexible board along the optical axis direction. Electronic components are positioned at different depths and lateral positions, creating spatial separation between heat-generating components and the image sensor. This dimensional approach allows compact overall design while maintaining adequate thermal isolation through strategic positioning in the third dimension.
Solution Approach 2:
The flexible board serves as an intermediary structure that physically connects electronic components to the circuit board while providing thermal isolation. The flexible board material acts as a thermal barrier, allowing electrical connectivity while reducing heat transfer to the image sensor. This intermediary approach enables components to be positioned close to the sensor for compactness while the flexible board mediates the thermal interaction.
2Device complexity
If power supply and signal processing units are integrated with the image sensor, then device complexity is reduced, but heat generation near the image sensor increases reducing image quality
Solution Approach 1:
The patent segments the camera module into distinct functional zones: the image sensor assembly, the flexible board with mounted electronic components, and the circuit board. This segmentation separates temperature-sensitive components (image sensor) from heat-generating components (power supply and signal processing units on the flexible board), allowing each to operate in its optimal thermal environment while maintaining functional integration through the flexible board interconnect.
Solution Approach 2:
The flexible board extends in the optical axis direction, creating spatial separation between the image sensor plane and the electronic components mounted on the flexible board. This three-dimensional arrangement allows power supply and signal processing units to be functionally integrated while physically positioned at different depths, reducing thermal coupling between high-power components and the image sensor.
3Temperature
If electronic components are dispersed on the flexible board, then heat dissipation is improved, but device complexity increases due to extended component layout
Solution Approach 1:
The flexible board performs multiple functions: it provides electrical connectivity between components, serves as a structural support for mounting electronic components, acts as a thermal isolation barrier, and enables spatial arrangement for heat dissipation. This multi-functionality consolidates what would otherwise require separate elements into a single integrated component, reducing overall device complexity while achieving effective heat management through dispersed component layout.
Data Source
AI summary
A camera module includes a housing, a lens, an assembly, a terminal, and an electronic component. The housing includes a front surface part, a rear surface part on the opposite side to that, and a side surface part connecting the front surface part and the rear surface part. The lens is exposed from the front surface part. The assembly includes an image sensor and is located on the rear surface part side relative to the lens. The terminal is located at the rear surface part for connection with an outside part. A flexible board includes a part extending from the assembly toward the terminal. The electronic component is mounted on the flexible board.