Camera Module Focus Adjustment via Flexible Wire Bonding
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Solution Overview
Problem
Existing camera modules for vehicle driver assistance systems face challenges in achieving precise focus adjustment with existing adhesive connections, which are time-consuming, costly, and prone to mechanical stress, while also requiring complex assembly processes.
Innovation Solution
The camera module employs flexible wire bonding connections between the image sensor chip and printed circuit board, allowing for precise focus adjustment by moving the image sensor chip relative to the optical system without the need for adhesive connections, using a chip support and support plate with recesses and bridges for secure fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive connection is used to focus the camera module, then focus adjustment is possible, but production time increases and manufacturing costs rise
Solution Approach 1:
The patent extracts the adhesive connection from the focusing mechanism. Instead of using adhesive to adjust focus, the invention uses a movable objective lens holder that can be positioned along the optical axis without adhesive, thereby eliminating the time-consuming adhesive curing process while maintaining focus adjustment capability
Solution Approach 2:
The patent replaces the chemical adhesive-based focusing mechanism with a mechanical positioning system. The objective lens holder can be mechanically adjusted along the optical axis and fixed in position without adhesive, substituting the chemical bonding process with a mechanical adjustment and fixation mechanism that is faster and more controllable
2Stability of the object's composition
If adhesive connection is used to hold optical elements, then structural stability is achieved, but the adhesive must withstand mechanical stress from electrical connections and environmental conditions
Solution Approach 1:
The patent extracts the adhesive connection from the optical element mounting process. The objective lens holder is mechanically attached to the support plate through a movable connection that allows positioning without adhesive, thereby eliminating the reliability issues associated with adhesive connections under mechanical stress and environmental conditions
Solution Approach 2:
The patent introduces an intermediary mechanical connection structure (the movable objective lens holder) between the support plate and the optical elements. This intermediary mechanism provides both positioning and structural support without relying on adhesive, distributing mechanical stresses away from any adhesive joints
3Stability of the object's composition
If adhesive curing is performed to secure focus adjustment, then focus position is fixed, but cycle time for production is extended
Solution Approach 1:
The patent extracts the adhesive curing step from the focus adjustment and fixation process. The objective lens holder is designed to be mechanically adjustable and fixable without adhesive, thereby removing the curing wait time from the production cycle while maintaining focus position stability through mechanical fixation
Solution Approach 2:
The patent implements preliminary mechanical positioning and fixation of the objective lens holder before final assembly completion. The focus adjustment is performed and mechanically secured in advance, allowing subsequent assembly steps to proceed without waiting for adhesive curing, thereby improving production throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-precision focus adjustment of up to ±10 μm, reduces manufacturing costs, and increases image resolution without requiring higher-quality optical elements, while eliminating the need for adhesive connections and associated production complexities.
Implementation Method 1
the assembly made up of the image sensor chip and the printed circuit board is designed in such a manner that the image sensor chip is focus-adjusted to the optical system by changing its position relative to the printed circuit board taking advantage of the flexibility of the wire bonding connections of the image sensor chip
Data Source
AI summary
A camera module including an objective lens housing with an optical system, an image sensor chip with wire bonding connections, and a printed circuit board for contacting the image sensor chip. The printed circuit board is designed with wire bonding areas to which the wire bonding connections of the image sensor chip are connected, and the assembly made up of the image sensor chip and the printed circuit board is designed in such a manner that the image sensor chip is focus-adjusted to the optical system by changing its position relative to the printed circuit board taking advantage of the flexibility of the wire bonding connections of the image sensor chip. The invention further relates to a method of manufacturing the camera module.