Camera Module Assembly Glue Containment Fixture
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Solution Overview
Problem
Conventional camera module assembly processes using thermosetting glue result in excess glue protrusions, leading to size issues and interference problems when integrated into portable electronic devices, necessitating a costly and quality-damaging glue-removing step.
Innovation Solution
The method involves arranging inner walls around the substrate's lateral edges to contain the glue, preventing overflow and allowing the camera module to maintain standard size without the need for a glue-removing step, by limiting the glue's movable range and ensuring proper sealing and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a great amount of thermosetting glue is used to seal the sensing chip and block stray light, then the imaging quality is improved, but the excess glue protrudes from the lateral periphery causing the camera module size to exceed standards
Solution Approach 1:
A fixture is introduced as an intermediary tool during the glue application process. The fixture includes positioning structures that hold the substrate and lens holder in precise alignment, and guiding structures that confine the glue within the bonding area. This mediator enables the use of sufficient glue for sealing and stray light blocking without causing excessive protrusion that would increase the final module size.
Solution Approach 2:
The fixture is assembled with the substrate before glue application, establishing precise positioning and boundaries in advance. The guiding structures of the fixture pre-define the acceptable glue distribution pattern, ensuring that when glue is applied, it remains confined to the bonding area between the substrate and lens holder, preventing lateral protrusion while maintaining adequate sealing.
2Reliability
If a great amount of thermosetting glue is used to ensure complete sealing, then particles are prevented from entering the camera module, but the excess glue requires an additional glue-removing step
Solution Approach 1:
The fixture serves as a mediator that controls glue flow and distribution during application. By incorporating guiding structures and positioning features, the fixture ensures glue is deposited precisely where needed for sealing, minimizing excess glue that would require removal. This eliminates the need for additional glue-removing steps while maintaining complete sealing quality.
Solution Approach 2:
The fixture's guiding structures automatically control the glue application process, confining the glue to the bonding area without requiring manual intervention or subsequent removal steps. The system self-regulates the glue distribution to achieve both complete sealing and clean edges, making the process self-sufficient without additional complexity.
3Manufacturing precision
If laser cutting method is used to remove excess glue, then the salient structures are removed, but material burning marks are generated and fabricating cost increases
Solution Approach 1:
The fixture is assembled and positioned before glue application, establishing precise boundaries and alignment. The guiding structures pre-confine the glue to the bonding area, preventing the formation of salient structures that would require laser cutting. This preliminary positioning action eliminates the need for costly laser cutting while maintaining surface quality.
Solution Approach 2:
Instead of allowing excess glue to form salient structures that require expensive laser removal, the fixture's guiding structures are designed to naturally channel and confine the glue flow. The potential harm of excess glue is converted into a benefit by using the fixture's geometry to automatically distribute glue evenly within the bonding area, eliminating the need for corrective removal operations.
4Manufacturing precision
If diamond water jet method or fine sane grinding method is used to remove excess glue, then the salient structures are removed, but dust enters the sensing chip deteriorating imaging quality
Solution Approach 1:
The fixture is assembled with the substrate and lens holder in advance, establishing precise positioning and glue confinement boundaries before glue application. The guiding structures ensure glue remains within the bonding area, preventing salient structure formation and eliminating the need for dust-generating removal operations. This preliminary action protects the sensing chip from dust contamination.
Solution Approach 2:
The fixture's guiding structures extract or remove the problematic aspect of excess glue by confining it to the bonding area during application. By taking out the possibility of glue overflow before it occurs, the need for subsequent removal operations that generate dust is eliminated, protecting the sensing chip from contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach eliminates the need for a glue-removing step, preventing interference issues and maintaining imaging quality while adhering to miniaturization standards for portable electronic devices.
Implementation Method 1
after the excess thermosetting glue 14 is baked at the high temperature, the excess thermosetting glue 14 is solidified
Data Source
AI summary
An assembling method is provided for assembling a camera module with a substrate and a lens module includes the following steps. In a step (A), a sensing chip is installed on a surface of the substrate. In a step (B), a fixture is assembled with the substrate, wherein plural inner walls of the fixture are arranged around at least a lateral edge of the substrate. In a step (C), a glue is coated on a periphery of the surface of the substrate, wherein a movable range of the glue is limited by the plural inner walls of the fixture. In a step (D), a lens holder of the lens module is installed on the surface of the substrate, so that the lens holder and the substrate are combined together through the glue. In a step (E), the fixture is separated from the substrate.