Camera Module with Embedded Component Grooves
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Solution Overview
Problem
The existing camera modules face challenges in minimizing their size due to the need for a larger plastic base to cover both the image sensor and electronic components, resulting in increased overall dimensions.
Innovation Solution
The camera module design incorporates receiving grooves on the circuit board to embed electronic components and gold wires, allowing the plastic base to cover these components without increasing its lateral size, achieved through injection molding that aligns the base's side surface with the grooves' inner walls, thereby reducing the module's total size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the plastic base is enlarged to cover electronic components, then the coverage and protection are improved, but the total size of the camera module increases
Solution Approach 1:
The patent embeds electronic components into receiving grooves formed directly within the circuit board structure. This nesting approach allows components to be housed within the existing footprint of the circuit board rather than requiring additional space, thereby maintaining protection and coverage while preventing increase in total module size
Solution Approach 2:
The patent transitions from a planar arrangement where components sit on the surface to a three-dimensional arrangement with vertical grooves. By utilizing the vertical dimension to create receiving grooves that extend downward from the circuit board surface, components are embedded within the board thickness rather than expanding the lateral footprint
2Ease of manufacture
If electronic components are mounted on the circuit board surface, then assembly is simplified, but the lateral size increases requiring a larger plastic base
Solution Approach 1:
The patent combines the circuit board structure with component housing features by integrating receiving grooves directly into the board. This merging of functions allows the circuit board to simultaneously serve as both the mounting substrate and the protective enclosure, eliminating the need for separate component housings and reducing lateral dimensions
Solution Approach 2:
Electronic components are nested within receiving grooves that are formed as part of the circuit board structure. This nesting eliminates the need for separate mounting steps and external housings, simplifying assembly while reducing the overall lateral size required for the plastic base
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the lateral size of the camera module by embedding components within the circuit board, resulting in a more compact form factor without increasing the base's dimensions, enhancing the module's miniaturization capabilities.
Implementation Method 1
The base 50 is formed on the circuit board 10 and the image sensor 20 by injection molding
Data Source
AI summary
A camera module comprises a circuit board and a base. A circuit board comprises a first surface and a second surface opposite to the first surface. At least one receiving groove is defined in the first surface. The receiving groove has not extended through the second surface. Each the at least one receiving groove receives an electronic component, and a height of the electronic component is less than a depth of the receiving groove. A base is fixed on the top surface. The at least one receiving groove is covered by the base to seal electronic components. A side surface of the base is aligned with a wall of the receiving groove.