Camera Module Ground Connection Structure with Vapor Chamber ESD Path
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Solution Overview
Problem
Mobile electronic devices with reduced circuit board area face challenges in providing sufficient grounding against electrostatic discharge (ESD) due to increased heat emission and added electrical components, which can disrupt operations and damage internal components.
Innovation Solution
An electronic device with a ground connection structure incorporating a metal housing, a vapor chamber, and a varistor to form a discharge path, including a conductive pad connected to the camera module, an electrical absorption member, and an insulating adhesive member to manage ESD effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the circuit board area is reduced to accommodate more functions and larger batteries, then the device can include more electrical components and larger batteries, but the grounding function against ESD becomes insufficient
Solution Approach 1:
The patent combines the heat dissipation function and grounding function into a single integrated structure. The metal housing serves dual purposes: it acts as a heat dissipation path for thermal management and simultaneously provides ESD grounding protection. This merging allows the device to maintain reliable grounding and heat dissipation capabilities even with a reduced circuit board area.
2Temperature
If heat dissipation structures are added to the device, then heat emission from internal components can be managed, but the device complexity increases
Solution Approach 1:
The metal housing is designed to perform multiple functions simultaneously: it provides structural support, serves as a heat dissipation path, and acts as an ESD grounding structure. By making the housing multi-functional, the patent avoids adding separate dedicated heat dissipation structures, thereby managing heat effectively while minimizing increases in device complexity.
3Reliability
If ESD protection measures are implemented, then internal components can be protected from static electricity damage, but the device complexity and component count increase
Solution Approach 1:
The metal housing serves its own structural purpose while simultaneously providing ESD protection functionality. The housing's inherent conductivity and grounding connection to the circuit board allow it to protect internal components from ESD without requiring additional dedicated protection components, thus achieving reliability improvement without increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor chamber and metal part of the housing serve as effective grounds, preventing damage and erroneous operation of internal components by dissipating heat and managing ESD, enhancing the device's robustness against static electricity.
Implementation Method 1
a vapor chamber interposed between the plate structure and the printed circuit board, having a conductivity
Implementation Method 2
the vapor chamber and metal part of the housing serve as effective grounds, preventing damage and erroneous operation of internal components by dissipating heat
Implementation Method 3
The ESD (e.g., static electricity) may be applied to the metal part of the electronic device. The ESD may disturb the operation of electronic devices
Implementation Method 4
a varistor configured to form an electric short circuit between the metal housing and the vapor chamber, when static electricity is applied to the metal housing
Data Source
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AI summary
An electronic device is disclosed. The electronic device may comprise: a housing comprising a metal portion, wherein the metal portion comprises a frame structure for forming a portion of the surface of the electronic device, and a plate structure extending into an inner space of the housing; a printed circuit board disposed on the plate structure; a camera module disposed on the plate structure, wherein the camera module comprises a connector coupled to the printed circuit board and the connector comprises a conductive pad electrically connected to a ground area of the camera module; a vapor chamber which is conductive and disposed between the plate structure and the printed circuit board and at least a portion of which faces the conductive pad of the connector; an electrical absorption member disposed between the vapor chamber and the conductive pad; an insulative adhesion member disposed between the vapor chamber and the plate structure; and a varistor for electrically connecting the vapor chamber and the metal portion. Various other embodiments identified from the specification are possible.